Copper Skived Fin 1U Server CPU Heat Sink

Product Introduction

With the rapid development of enterprise informatization, the demand for servers is also increasing. How to plan and implement the servers reasonably in the limited space of the computer room, we have to pay attention to these problems. Because of its flexible configuration and high computing density, rack-mounted servers have advantages over tower servers in terms of saving energy costs, maintenance costs, and environmental costs. These advantages provide a wide range of development space for the construction of large and medium-sized information systems for 1U servers.

So what is a 1U server? The so-called 1U server is a high-availability and high-density low-cost server platform, which is specially designed for special application industries and high-density computer environments. They can start their own operating systems through the local hard disk, such as Windows NT/2000/2003, Linux, Solaris, etc., similar to an independent server. In this mode, each motherboard runs its own system, serving different user groups specified, and is not related to each other. However, we can still use the system software to integrate these motherboards into a server cluster.

Since the frequency of the CPU used by the server is usually high, some have dual CPUs or even multiple CPUs, coupled with high-speed SCSI hard disks and high-power power supplies, these components usually generate a lot of heat, so a high efficiency server heatsink is essential.

As we all know that copper is an extraordinary thermal conductor, it can absorb and spread the heat from the server CPU rapidly. so a full copper skived fin 1U server heatsink is quite popular in the server industry.

In simple terms, skiving technology is to cut a whole piece of aluminum or copper according to the specified heatsink shape, and use a skiving machine to produce the fins with a standard spacing and a certain thickness and height. Due to the use of high-precision cutting technology and integrated forming, compared with other processing techniques, the same volume of raw materials can cut a larger heat dissipation area, and the heat transfer performance is more stable. Under the same conditions, the heat dissipation effect is much better than extruded heatsink. The efficiency of the radiator is more than 1.5 to 2 times, which can prolong the service life of the devices by better thermal performance.

Compared with extruded heatsink, the skived fin heatsink can be designed with smaller space and thinner fins, so it is mostly used for high power devices. However, due to the skiving process, each radiator needs to be manufactured from a metal bar, which means that we have to optimize each specifications of the skived fin heatsink in the early stage of each project design, including the thickness of the base, the height and thickness of the fins, the fin space and other specifications.

Product specifications

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