Copper CPU Radiator With Heat Pipe

Product Introduction

Copper zipper fin heat pipe heat sink is composed of copper stamped zipper fin, copper plate and heat pipes. Copper stamped zipper fin stack is a critical component due to it has great heat dissipation performance. A stamped zipper fin stack is manufactured by using a stamping process to punch the copper sheets into designed shape from a tooling die. The fin stack are manufactured to create interlocking fins by stamping process, the copper zipper fin can be manufactured with a range of geometrics and thickness. The stamping fin technique provides high production efficiency, high aspect ratio, lightweight, and good thermal performance. Also it offers low Non recurring engineering charge, so the prototype cost can be minimal.Heat pipe is a very high effective thermal device, it's a two phase thermal component which transport the heat from the heat source to the copper fins rapidly to avoid the electronic components overheating. This heatsink is designed for high power electronic devices such as CPU, IGBT, Inverter,etc.
Sinda Thermal offers varieties of CPU heat sink and coolers for many Intel and AMD CPU types such as LGA4677, LGA4189, LGA4677,LGA1700,LGA1200/115X, LGA3647,AMD SP3, AMD SP5,etc.

Product specifications

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