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In recent years, electronic components are increasingly developing and trending to miniaturization and high power consumption. How to solve the problem of performance degradation caused by electronic components overheating, for the high power electronic devices, the heat pipe two-phase cooling device has become an efficient heat transfer device due to the large thermal conductivity generated by the phase change. But for some special conditions like the heat flux of CPU is very high, even the heat pipe could not remove the heat timely, we need a thermal component which can spread the heat faster to secure the electronic components, vapor chamber was invented to solve this type of thermal issues.
As a new type of two-phase flow thermal technology, the vapor chamber has the advantages of high thermal conductivity, good temperature uniformity, and reversible heat flow direction. It overcomes the problems of small contact area, large thermal resistance and uneven heat flow density of traditional heat pipes. Become one of the effective ways to solve the heat dissipation of electronic devices with high heat flux density in the electronics industry.
The vapor chamber is composed of a closed cavity, a capillary structure and a working fluid. In order to ensure the efficient heat exchange performance of the chamber, the outer shell is usually made of materials with high thermal conductivity, usually is copper, and a liquid absorbent core is attached around the inner wall. In order to meet the pressure resistance requirements, Some vapor chambers are designed with a solid column, a sintered column, or a wick attached to the outer surface of the solid column to form a sintered ring.
The working principle of vapor chamber
When heat is applied to the bottom of the vapor chamber, the liquid evaporates by the heat increasing, the vapor rises to the top of the container to generate condensation, and the liquid returns to the evaporation surface by the capillary force of the wick to form a circulation. Compared with the traditional heat pipe, the axial dimension of the vapor chamber is greatly shortened, which reduces the flow resistance loss of the working medium and the axial thermal resistance. At the same time, the radial size has increased, which significantly increases the area of the evaporation surface and the condensation surface, and has a smaller diffusion thermal resistance and higher temperature uniformity. This special structure improves the heat dissipation capability of the vapor chamber, increases the reliability of the cooled electronic equipment, and provides a new solution to the problem of temperature uniformity under high heat flow in a limited space.
When the vapor chamber absorbing the heat and spread it rapidly, but how to dissipate the heat to the air? we need some fins to expand the thermal surface for heat dissipation. As aluminum is a better heat dissipated material, so usually we will use aluminum zipper fin to solder with vapor chamber, aluminum zipper fin vapor chamber CPU cooler is a perfect assembly, which combines the extremely heat transferring ability of vapor chamber and excellent heat dissipation ability of aluminum zipper fins, this type of heatsink can satisfy the thermal requirements of high heat flux density electronic components. Aluminum zipper fin vapor chamber CPU cooler are widely used in electronics and eletrics area.
Sinda Thermal is experienced in vapor chamber design and manufacturing, please feel free to contact us if you have any thermal requirements.