EAVC Passive CPU Heatsink 1U Server CPU Radiator Copper Plate For LGA4677
Aluminum Zipper Fin Copper Plate 1U Server EAVC CPU Radiator For LGA4677
Product Introduction
LGA4677 CPU heat sink is designed for Intel LGA4677 socket, this CPU heat sink cooler consists of aluminum stamped zipper fin, aluminum base, copper block and heat pipes. Aluminum stamped zipper fin stack is a critical component due to it has great heat dissipation performance. A stamped zipper fin stack is manufactured by using a stamping process to punch the aluminum sheets into designed shape from a tooling die. The fin stack are manufactured to create interlocking fins by stamping process, the aluminum zipper fin can be manufactured with a range of geometrics and thickness. The stamping fin technique provides high production efficiency, high aspect ratio, lightweight, and good thermal performance. Also it offers low Non recurring engineering charge, so the prototype cost can be minimal.Heat pipe is a very high effective thermal device, it's a two phase thermal component which transport the heat from the heat source to the aluminum fins rapidly to avoid the electronic components overheating. This heatsink is designed for high power electronic devices such as CPU, IGBT, Inverter,etc.
Sinda Thermal offers varieties of CPU heat sink and coolers for many Intel and AMD CPU types such as LGA4677, LGA4189, LGA4677,LGA1700,LGA1200/115X, LGA3647,AMD SP3, AMD SP5,etc.
Product specifications
| Material | Aluminum and copper | Certificates | ISO 9001:2015,ISO 14001:2015 |
| Product dimension | 125mm*102.0mm*155.0mm | Type | Soldering heat sink |
| Process | Stamping, CNC, soldering | Lead time | 4 weeks |
| Surface finish | Passivation, nickel plating | Packing | Tray, carton |
| OEM/ODM | Yes | Quality control | 100% |
| Application | LGA4189 CPU socket | Warrantly | 1 year |
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