Copper Zipper Fin Vapor Chamber 1u Server Heat Sink For LGA4189 CPU Socket

Product Introduction

LGA4189 active CPU heat sink is designed for Intel LGA4189 socket, this CPU heat sink cooler consists of copper stamped zipper fin, copper vapor chamber. Stamped zipper fin stack is a critical component due to it has great heat dissipation performance. A stamped zipper fin stack is manufactured by using a stamping process to punch the copper sheets into designed shape from a tooling die. The fin stack are manufactured to create interlocking fins by stamping process, the copper zipper fin can be manufactured with a range of geometrics and thickness. The stamping fin technique provides high production efficiency, high aspect ratio, lightweight, and good thermal performance. Also it offers low Non recurring engineering charge, so the prototype cost can be minimal.vapor chamber is a very high effective thermal device, it's a two phase thermal component which transport the heat from the heat source to the copper fins rapidly to avoid the electronic components overheating. This heatsink is designed for high power electronic devices such as CPU, IGBT, Inverter,etc.
Sinda Thermal offers varieties of CPU heat sink and coolers for many Intel and AMD CPU types such as LGA4677, LGA4189, LGA4677,LGA1700,LGA1200/115X, LGA3647,AMD SP3, AMD SP5,etc.

Product specifications

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