CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
                                                                                                           
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TIC800P Low Melting Point Thermal Interface Material 0.95W/mK Conductivity 50-60°C Phase Change

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000pcs
Delivery Time: 3-6 work days
Brand: Ziitek
Product Description
TIC800P Low Melting Point Thermal Interface Material
The TIC™800P series is a low melting point thermal interface material designed for efficient heat transfer in electronic applications. At 50°C, the material begins to soften and flow, filling microscopic irregularities between thermal solutions and integrated circuit package surfaces to significantly reduce thermal resistance.
At room temperature, TIC™800P remains a flexible solid that stands freely without reinforcement components that could compromise thermal performance.
The material demonstrates exceptional reliability with no thermal performance degradation after 1,000 hours at 130°C or 500 thermal cycles from -25°C to 125°C. Its unique softening behavior prevents full phase change, resulting in minimal migration (pump out) at operating temperatures.
TIC800P thermal interface material product display
Key Features
  • 0.021℃-in²/W thermal resistance
  • Naturally tacky at room temperature - no adhesive required
  • No heat sink preheating required
Applications
  • Automotive electronics
  • Set top boxes
  • Power monitoring boxes
  • AD-DC power adapters
  • Rainproof and waterproof LED power systems
Typical Properties of TIC™800P Series
Product Name TIC™805P TIC™806P TIC™810P Test Method
Color Pink Visual
Thickness 0.005"/0.126mm 0.008"/0.203mm 0.010"/0.245mm ******
Thickness Tolerance ±0.0008"/±0.019mm ±0.0008"/±0.019mm ±0.0012"/±0.030mm ******
Specific Gravity 2.2 g/cc Helium Pycnometer
Temperature Range -25 to 125℃ ******
Phase Change Softening Temperature 50℃-60℃ ******
Thermal Conductivity 0.95W/mK ASTM D5470
Thermal Impedance@50psi 0.24℃-in²/W
0.15℃-cm²W
0.053℃-in²/W
0.34℃-cm²W
0.080℃-in²/W
0.52℃-cm²W
ASTM D5470
Standard Specifications
Standard Thicknesses: 0.005" (0.127mm), 0.008" (0.203mm), 0.010" (0.254mm)
Contact factory for alternate thickness options.
Standard Sizes: 12" x 16" (304.8mm x 406mm), 12" x 400" (304.8mm x 121.92m)
TIC800P series products are supplied with white release paper and bottom liner. Available in kiss cut with extended pull tab liner or individual die cut shapes.
Pressure Sensitive Adhesive: Not applicable for TIC800P series products.
Reinforcement: No reinforcement necessary.
TIC800P thermal material technical specifications
Manufacturer Information
Ziitek is a Vietnam-based manufacturer specializing in thermal management solutions including thermal conductive gap fillers, low melting point thermal interface materials, thermal insulators, conductive tapes, interface pads, thermal grease, thermal conductive plastics, silicone rubber, silicone foams, and phase changing materials.

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Company CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
Location Plot CN4, Ming Lang Industrial Cluster, Thu Tri Commune, Hung Yen Province, Vietnam
Contact Person Sophia

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