The TIC800H series is a high-performance, cost-effective thermal interface material featuring a unique grain-oriented structure that enables precise conformity to device surfaces, enhancing thermal conduction paths and transfer efficiency.

When temperature exceeds its phase transition point of 50°C, the material softens and undergoes phase change, effectively filling microscopic and uneven gaps between components to form a low thermal resistance interface, significantly improving heat dissipation performance.

• Low thermal resistance for efficient heat transfer
• Self-adhesive design eliminates need for additional surface adhesives
• Optimized for low-pressure application environments
• Thermal conductivity of 7.5 W/mK
• Phase change softening temperature: 50°C-60°C

• Power conversion equipment
• Power supply and vehicle storage battery systems
• Large communication switch hardware
• LED TV and lighting applications
• Laptop computer thermal management

Standard Thickness: 0.008" (0.20 mm), 0.010" (0.25 mm), 0.012" (0.30 mm). For other thickness options, please contact us.

Standard Size: 10" x 16" (254 mm x 406 mm)

Pressure-Sensitive Adhesive: Not applicable to TIC800H series products. Reinforcement Material: No reinforcement material required.

Ziitek is a high-tech enterprise dedicated to the research, development, manufacturing, and sales of thermal interface materials (TIMs). With extensive experience in thermal management solutions, we provide the latest and most effective thermal management technologies.

Our facilities include advanced production equipment, comprehensive testing instruments, and fully automatic coating production lines capable of manufacturing high-performance thermal silicone pads, thermal graphite sheets/films, thermal double-sided tape, thermal insulation pads, thermal ceramic pads, phase change materials, thermal grease, and more. All products comply with UL94 V-0, SGS, and ROHS standards.