TIC800G Low-Melting CPU Thermal Pad - 5.0 W/mK Conductivity, 0.005-0.012 Inch Thickness Options
TIC800G Series is a high-performance thermal interface material featuring a unique grain-oriented structure that enables precise conformity to device surfaces, enhancing thermal conduction paths and transfer efficiency. When temperature exceeds its phase transition point of 50°C, the material softens and undergoes phase change, effectively filling microscopic and uneven gaps between components to form a low thermal resistance interface.
- Low thermal resistance for efficient heat transfer
- Self-adhesive design eliminates need for additional surface adhesives
- Suitable for low-pressure application environments
- Thermal conductivity: 5.0 W/mK
- Operating temperature range: -40°C to 125°C
- Power conversion equipment
- Power supply and vehicle storage battery systems
- Large communication switch hardware
- LED TV and lighting systems
- Laptop computer thermal management
| Property | TIC805G | TIC806G | TIC808G | TIC810G | TIC812G | Test Method |
|---|---|---|---|---|---|---|
| Thickness | 0.005" (0.127mm) | 0.006" (0.152mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | 0.012" (0.305mm) | ASTM D374 |
| Thermal Impedance @50 psi | 0.014 °C-cm²/W | 0.018 °C-cm²/W | 0.02 °C-cm²/W | 0.024 °C-cm²/W | 0.028 °C-cm²/W | ASTM D5470 |
- Color: Gray
- Density: 2.6 g/cc (ASTM D792)
- Phase Change Softening Temperature: 50°C-60°C
- Sheet size: 10" × 16" (254 mm × 406 mm)
- Roll size: 16" × 400' (406 mm × 122 m)
Ziitek Company leverages professional R&D capabilities and extensive experience in thermal interface materials. Our unique formulations represent core technologies and competitive advantages. We are committed to providing quality, cost-effective products to customers worldwide for long-term business partnerships.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.