CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
                                                                                                           
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TIC800A-AL Low Melting Point Thermal Phase Change Material 2.5 W/mK Conductivity for Memory Modules

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000pcs
Delivery Time: 3-6 work days
Brand: Ziitek
Product Description
TIC800A-AL Low Melting Point Thermal Phase Changing Material
TIC800A-AL series is a low melting point thermal interface material designed for memory modules and electronic components. At 50°C, the material begins to soften and flow, filling microscopic irregularities between thermal solutions and integrated circuit packages to effectively reduce thermal resistance.
This material remains a flexible solid at room temperature and operates without reinforcing components that could compromise thermal performance.
TIC800A-AL thermal phase changing material product display
Key Features
  • 0.021℃-in²/W thermal resistance
  • Naturally tacky at room temperature - no adhesive required
  • No heat sink preheating required
  • Maintains thermal performance after 1,000 hours at 130°C
  • Stable through 500 cycles from -40°C to 125°C
  • Minimal migration at operating temperatures
Applications
  • Notebook computers
  • Power supply units
  • Heat pipe thermal solutions
  • Memory modules
  • Mass storage devices
  • Automotive electronics
  • Set top boxes
  • Audio and video components
  • IT infrastructure
  • GPS navigation and portable devices
Technical Specifications
Property TIC805A-AL TIC808A-AL TIC810A-AL TIC820A-AL Test Method
Color Gray/Silver Gray/Silver Gray/Silver Gray/Silver Visual
Thickness 0.005" (0.126mm) 0.008" (0.203mm) 0.010" (0.254mm) 0.020" (0.508mm)
Thickness Tolerance ±0.0008" (±0.019mm) ±0.0008" (±0.019mm) ±0.0012" (±0.030mm) ±0.0020" (±0.050mm)
Density 2.5g/cc Helium Pycnometer
Temperature Range -25°C to 125°C
Phase Change Temperature 50°C-60°C
Thermal Conductivity 2.5 W/mK ASTM D5470 (modified)
Thermal Impedance @ 50 psi 0.063℃-in²/W (0.40℃-cm²/W) 0.08℃-in²/W (0.52℃-cm²/W) 0.097℃-in²/W (0.63℃-cm²/W) 0.157℃-in²/W (1.13℃-cm²/W) ASTM D5470 (modified)
Standard Specifications
  • Standard Thicknesses: 0.005" (0.127mm), 0.008" (0.203mm), 0.010" (0.254mm), 0.020" (0.508mm)
  • Standard Size: 10" x 16" (254mm x 406mm)
  • Supplied with white release paper and bottom liner
  • Available in kiss cut, extended pull tab liner, or individual die cut shapes
  • No pressure sensitive adhesive required
  • No reinforcement necessary
TIC800A-AL thermal material technical specifications and packaging

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
Location Plot CN4, Ming Lang Industrial Cluster, Thu Tri Commune, Hung Yen Province, Vietnam
Contact Person Sophia

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