TIF100-06U Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling

Product descriptions

TlF100-06U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features

> Good thermal conductivity 1.5W/mK
> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stress application
> Available in varies thickness

> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant

Application

> LED Ceilinglamp
> Monitoring the Power Box
> AD-DC Power Adapters
> Heat pipe thermal solutions
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply

Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes:

8" x 16"(203mm x406mm),Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Independent R&D team

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