Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable
Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable
Product descriptions:
HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product
Product features:
Low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation
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Before curing |
builder |
Epoxy resin 5508 |
Curing agent 5508 |
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pigment |
Black / White et al |
Ruburn / transparent surface |
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A sticky epoxy resin water |
r liquid specific |
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c gravity, g / cm3 |
1.4-1.5 |
1.05 |
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Viscosity of 25℃ |
4,500—6,000cp s |
150—250cp storage |
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e Period (25℃) |
Six months |
x months |
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processabili
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mixing ratio |
A: B =5:1 (weight ratio) |
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Available for a time of 25℃ |
2-3H (100g mix) |
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curing time |
25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H |
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After curing |
2 Tensile strength of kg/cm |
16-18 |
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2 Compressive strength of kg/cm |
18-22 |
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Resistance to the voltage of kv/mm |
20-22 |
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Surface resistance ofΩ-cm |
14 1.2*10 |
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Volume resistance ofΩ-cm |
15 1.1*10 |
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contraction percentage% |
0.35-0.55 |
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Water absorption rate was 25℃ * 24H |
<0.03% |
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The hardness of SHORE A |
85-95 |
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distortion temperature ℃ |
130-150 |
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low temperature resistant ℃ |
-30 |
Application:
HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers
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