Epoxy Potting Compound 5:1 Electrical Adhesive Potting For Power Module Transformer PCB SENSOR
Epoxy Potting Compound 5:1 Electrical Adhesive Potting For Power Module Transformer PCB SENSOR
Product Description of epoxy potting compound:
Epoxy potting compound is a high-performance insulating and sealing material, mainly used to protect electronic components through potting, filling, or encapsulation, and cured at room temperature or by heating.
Product Features of epoxy potting compound:
Insulation and Sealing: Moisture-proof, corrosion-proof, and dust-proof, suitable for harsh environments.
Mechanical Protection: High hardness after curing, resistant to vibration and impact.
Thermal Management: Some models have good thermal conductivity, aiding in component heat dissipation.
Chemical Stability: Resistant to acids, alkalis, and solvents, extending product lifespan.
Physical Properties of epoxy potting compound:
| efore curing | builder | Epoxy resin 5508 | Curing agent 5508 |
| pigment | Black / White et al | Ruburn / transparent surface | |
| A sticky epoxy resin water | r liquid specific | ||
| c gravity, g / cm3 | 1.4-1.5 | 1.05 | |
| Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage | |
| e Period (25℃) | Six months | x months | |
|
processabili
|
mixing ratio | A: B =5:1 (weight ratio) | |
| Available for a time of 25℃ | 2-3H (100g mix) | ||
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H | ||
| After curing | 2 Tensile strength of kg/cm | 16-18 | |
| 2 Compressive strength of kg/cm | 18-22 | ||
| Resistance to the voltage of kv/mm | 20-22 | ||
| Surface resistance ofΩ-cm |
14 1.2*10 |
||
| Volume resistance ofΩ-cm |
15 1.1*10 |
||
| contraction percentage% | 0.35-0.55 | ||
| Water absorption rate was 25℃ * 24H | <0.03% | ||
| The hardness of SHORE A | 85-95 |
|
distortion temperature ℃ |
130-150 |
| low temperature resistant ℃ | -30 |
Product application of epoxy potting compound
Power Modules:Switching power supplies, inverters, UPS systems, transformers, etc., used for moisture-proofing, heat dissipation, insulation, and shock resistance.
Circuit Board Protection:Waterproof and dustproof sealing for PCBs, sensors, and controllers (e.g., automotive ECUs, industrial PLCs).
High-Voltage Equipment:High-voltage capacitors, ignition coils, insulators, etc., to enhance insulation and arc resistance.
New Energy Equipment:Protection for internal components of solar inverters, wind power controllers, and charging piles.
Automotive Electronics: Engine control modules (ECUs), onboard chargers, battery management systems (BMS), headlight drivers, etc.
Rail Transportation: Insulation and sealing for signaling control systems and traction converters.
Aerospace:Protection for airborne electronic equipment against high/low temperatures and vibration.
Motors and Drives:Potting for windings of servo motors and stepper motors to improve thermal conductivity and environmental resistance.
Industrial Sensors: Protection for pressure/temperature/flow sensors in harsh environments (e.g., chemical plants, oil fields).
Tool Equipment: Sealing for circuit modules in power tools and welding equipment.
Lithium Battery Packs: Filling gaps between cells and securing modules to enhance heat dissipation and mechanical stability.
Photovoltaic Systems:Waterproof sealing for PV junction boxes and combiner boxes.
Hydrogen Energy Equipment:** Sealing and insulation for fuel cell stacks.
Package:
This product is 40KG per group;
Component A is 20KG (in barrels), and Component B is 20KG (in barrels)
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