Black Epoxy Potting Compound For Power Module 5:1 High-Voltage Resistance Epoxy Resin AB Glue
Black Epoxy Potting Compound For Power Module 5:1 High-Voltage Resistance Epoxy Resin AB Glue
Description of Epoxy Potting Compound
Epoxy potting compounds are thermosetting polymer encapsulation materials based on epoxy resin, formulated with curing agents, fillers, and functional additives; they are available in two system types: two-component room-temperature curing and one-component high-temperature curing.
These materials are widely used in applications such as electronic transformers, electronic control units for new energy vehicles, and power modules for 5G base stations, protecting circuit components from moisture, vibration, and high voltage.
technical parameter of epoxy potting compound:
| efore curing | builder | Epoxy resin 5508 | Curing agent 5508 |
| pigment | Black / White et al | Ruburn / transparent surface | |
| A sticky epoxy resin water | r liquid specific | ||
| c gravity, g / cm3 | 1.4-1.5 | 1.05 | |
| Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage | |
| e Period (25℃) | Six months | x months | |
|
processabili
|
mixing ratio | A: B =5:1 (weight ratio) | |
| Available for a time of 25℃ | 2-3H (100g mix) | ||
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H | ||
| After curing | 2 Tensile strength of kg/cm | 16-18 | |
| 2 Compressive strength of kg/cm | 18-22 | ||
| Resistance to the voltage of kv/mm | 20-22 | ||
| Surface resistance ofΩ-cm |
14 1.2*10 |
||
| Volume resistance ofΩ-cm |
15 1.1*10 |
||
| contraction percentage% | 0.35-0.55 | ||
| Water absorption rate was 25℃ * 24H | <0.03% | ||
| The hardness of SHORE A | 85-95 |
|
distortion temperature ℃ |
130-150 |
| low temperature resistant ℃ | -30 |
Product Features of epoxy potting compound:
Application of epoxy resin potting:
Epoxy potting compounds are widely used in the encapsulation of power modules. Their stable, excellent resistance to aging and chemicals provides effective isolation; their thermal conductivity facilitates heat dissipation, while their thermal insulation properties protect internal components. Upon curing, they exhibit superior physical characteristics—including high hardness, high strength, and low brittleness—that effectively withstand mechanical impact and vibration, while offering waterproofing and dustproofing to ensure the stability and reliability of the power modules.
Furthermore, these epoxy potting compounds are extensively used for the potting and insulation protection of various electronic components and assemblies, such as electronic transformers, AC capacitors, negative ion generators, aquarium pumps, ignition coils, electronic modules, motorcycle electronic voltage regulators, display screens, communication cable connectors, and various other transformers and coils.
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