Flame Retardant Epoxy Potting Compound For Safety Critical Industrial Electronics

Epoxy potting compounds are thermosetting encapsulants with epoxy resin as the base material, compounded with curing agents, inorganic fillers and functional additives. They fall into two main categories: two-part room-temperature cure systems and single-part heat-cure systems.

Commonly adopted for electronic transformers, NEV electronic control units, and 5G base station power modules, these materials shield circuit components against moisture ingress, mechanical vibration and high-voltage breakdown.

• This product is a two-component system (AB agent). Follow the weight ratio specified on the product package - this is a weight ratio, not volume ratio.
• Do not mix AB components with a round bar without resistance. Always use a flat tool with resistance, preferably a small mixer.
• Store in a cool, dry place away from light. Maintain a dust-free workshop environment and cover unused compound promptly.
• Performance test data is based on 60% humidity and 25°C temperature conditions - for customer reference only.
• Epoxy potting compound stored in humid environments may crystallize. Restore to original state by low-temperature oven drying.

• Store in a cool, dry place with a shelf life of 6 months (below 25°C).
• Products beyond the storage period should be inspected for abnormalities before use.
• Components A and B must be sealed and preserved. Prevent leakage during transportation.
• This product is classified as non-dangerous goods and can be transported as general chemicals.

This product is packaged as 30 KG per set, including:

• Component A: 25 KG (barrel)
• Component B: 5 KG (pot)