Black Epoxy Potting Compound 5:1 Fire Retardant High Temperature Encapsulant for Power Supply Module
Black Epoxy Potting Compound 5:1 Fire Retardant High Temperature Encapsulant for Power Supply Module
HN-5508AB is a black two-component epoxy potting compound with a 5:1 mix ratio, specially formulated for power supply module, LED driver and other electronic component encapsulation. It cures at room temperature or low temperature with low viscosity, long working time and good fluidity, easily penetrating into narrow clearances of the product. After curing it delivers a bubble-free, smooth and glossy surface with high hardness, excellent flame retardancy and long-term high temperature resistance.
Key Features
- 5:1 two-component system: simple weight-ratio mixing, low viscosity 4,500-6,000 cps (Part A), excellent penetration for dense coil and PCB assemblies.
- Fire retardant & high temperature resistance: heat distortion temperature 130-150℃, low temperature resistant to -30℃, suitable for continuously operating power modules.
- High electrical insulation: dielectric strength 20-22 kV/mm, volume resistivity 1.1×1015 Ω·cm, protects power supply circuits from arcing and moisture.
- Low shrinkage & low water absorption: shrinkage 0.35-0.55%, water absorption <0.03%, stable dimensional and electrical performance in humid environments.
- Fast curing options: 25℃/6-8H surface dry and 12-16H fully cured, or accelerated 60-80℃/1.5-2H for high-volume production lines.
- ROHS SGS compliant: meets international environmental requirements for electronic encapsulation materials.
Technical Parameters
| Item | Specification |
|---|---|
| Appearance | Part A: Black liquid; Part B: light yellow transparent liquid |
| Mix Ratio | A:B = 5:1 (weight ratio) |
| Viscosity (25℃) | Part A: 4,500-6,000 cps; Part B: 150-250 cps |
| Specific Gravity | Part A: 1.4-1.5; Part B: 1.05 |
| Pot Life (25℃) | 2-3H (100g mix) |
| Curing Condition | 25℃/6-8H surface dry, 12-16H fully cured; or 60-80℃/1.5-2H |
| Hardness | Shore D 85-95 |
| Tensile Strength | 16-18 kg/cm² |
| Compressive Strength | 18-22 kg/cm² |
| Dielectric Strength | 20-22 kV/mm |
| Surface Resistance | 1.2×1014 Ω·cm |
| Volume Resistance | 1.1×1015 Ω·cm |
| Shrinkage | 0.35-0.55% |
| Water Absorption (25℃×24H) | <0.03% |
| Heat Distortion Temperature | 130-150℃ |
| Low Temperature Resistance | -30℃ |
| Flame Retardant | Yes (fire retardant grade) |
| Shelf Life (25℃ sealed) | 6 months |
Applications
HN-5508AB is widely used for power supply modules, LED drivers, transformers, resistors, filters, temperature sensors and controllers, ignition coils, high voltage packs and other electronic components requiring flame retardant, high temperature resistant and moisture-proof encapsulation.
Packing & Storage
Standard packing 25 kg/barrel; 1 kg sample kits available for evaluation. Store in a cool, dry and light-proof place, keep the workshop dust-free, and cover the unused glue promptly after opening. Shelf life 6 months under sealed storage at 25℃.
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