Low Viscosity 2:1 Mix Ratio Transparent Epoxy Potting Compound AB Glue for Electronic Encapsulation
Clear Epoxy Potting Compound 2:1 Self-Leveling Low Viscosity AB Glue for Narrow Gap Electronic Component Encapsulation
HN-5506A/B is a clear two-component epoxy potting compound with a 2:1 mix ratio, specially formulated for narrow gap and fine clearance encapsulation of electronic components. After mixing it exhibits excellent flowability and low viscosity, allowing it to easily penetrate into the minute gaps between components, coils and PCB traces before curing into a rigid, crystal-clear protective layer with high hardness and outstanding electrical insulation.
Key Features
- Low viscosity & excellent flowability: penetrates narrow gaps, fine clearances and dense component layouts without voids.
- 2:1 two-component system: simple mix ratio and self-leveling flow compatible with automatic dispensing lines.
- High transparency: crystal-clear cured body enables visual inspection of components and wire bonds after potting.
- High hardness: rigid 70-75 Shore D cured layer protects precision components against vibration and shock.
- Excellent insulation: prevents current leakage and short circuits in high-voltage and precision electronics.
- Anti-yellowing: maintains transparency under prolonged light exposure for LED modules and display applications.
- Wide temperature range: stable physical and electrical properties from -40℃ to 120℃.
- Moisture-proof & tamper-proof: seals modules against humidity while providing confidentiality protection.
- ROHS & SGS compliant: meets environmental requirements for electronics industries.
Technical Parameters
| Item | Specification |
|---|---|
| Model | HN-5506A/B |
| Mix Ratio (A:B) | 2:1 by weight |
| Color | Transparent |
| Viscosity | Low viscosity, excellent flowability, self-leveling |
| Hardness (Shore D) | 70-75 |
| Curing Time at 25℃ | 12-24 hours |
| Thermal Conductivity | 0.2-0.3 W/m·K |
| Temperature Resistance | -40℃ to 120℃ |
| Anti-yellowing | Yes, suitable for prolonged light exposure |
| Shelf Life | 6 months in sealed original containers |
Applications
Narrow-gap electronic modules, transformers, LED modules and lighting fixtures, indicator-light components, aquarium pumps, high-voltage components, precision sensors, relays, confidentiality modules and other precision electronic devices requiring transparent high-hardness encapsulation with deep gap penetration.
Customization and OEM/ODM supported. Contact us for free samples.
About this supplier
Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone and epoxy materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.
We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electronics, electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation. Headquartered in Shenzhen, Guangdong, China, we offer free samples, custom formulation and wholesale bulk supply at factory-direct pricing.
FAQ
Q1: What is HN-5506A/B and what is it designed for?
A1: HN-5506A/B is a two-component,
high-transparency epoxy crystal glue (Epoxy Potting Compound) with high hardness, low viscosity, excellent
self-levelling and defoaming. It cures to a crystal-clear, UV-resistant and anti-yellowing body, ideal for
narrow-gap encapsulation of electronic components, LED lighting, display modules, river tabletops and crystal
craft.
Q2: What is the mix ratio, pot life and curing schedule?
A2: Mix Component A and Component
B at a 3:1 ratio by weight. Pot life is 20-30 minutes at 25°C (150 g mix). Initial cure is 6-8 hours and full
cure 12-16 hours at 25°C, or a heat-accelerated cure in 1 hour at 80°C (room-temperature pre-cure recommended).
One-time pouring of up to 3-5 cm thickness at 25°C is supported with built-in defoaming.
Q3: What are the cured mechanical, electrical and thermal properties?
A3: Cured hardness
is Shore D 78-83; dielectric strength is 25 kV/mm; volume resistivity is 4.3 x 1015 ohm.cm and
surface resistivity 2.6 x 1014 ohm; the glass transition temperature (Tg) is above 90°C and
temperature resistance is -60°C to 135°C, with excellent adhesion and low cure shrinkage.
Q4: How should it be mixed, degassed and poured?
A4: Stir Component A thoroughly before
use (warm to 60-80°C if crystallised), weigh A and B at 3:1 by weight, mix thoroughly scraping the container
walls and bottom, optionally vacuum-degas for high clarity, then pour into the clean, dry mould or device
within the pot life. Do not move or stress the part during cure.
Q5: What are the packaging, storage and shelf life, and do you offer customization?
A5:
Supplied as Component A 15 kg plastic drum plus Component B 5 kg plastic drum (custom kits available). Store
sealed at 5-25°C away from sunlight and moisture; shelf life is 12 months. Classified as non-dangerous goods
for transport. Custom OEM/ODM formulation is supported - contact us for free samples.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.