Thermal Gap Filler

3.5mmT good performance thermal conductive gap filler 20 SHORE00,UL recognized For Automotive engine control 1.8W / MK The TIF5140-18-11US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. TIF500-18-11US Datasheet-REV02.pdf Features: > Good thermal

3.0mmT new developed thermal conductive gap pad 20 SHORE00,UL recognized For Monitoring the Power Box 1.8W / MK The TIF5120-18-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling TIF500-18-11US Datasheet-REV02.pdf Features: > Good

2.5mmT China company supplied silicone pads RoHS compliant For Mass storage devices 1.8W / MK The TIF5100-18-11US is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF5100-18-11US is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high

2.0mmT new developed silicone pads 20 Shore00 For Heat pipe thermal solutions 1.8W / MK The TIF580-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an

1.5mmT good performance thermal conductive gap filler 20 Shore00 For LED Power Supply 1.8W / MK The TIF560-18-11US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. TIF500-18-11US Datasheet-REV02.pdf Features: > Good thermal conductive: 1.8W/mK >Thickness:1

1.0mmT silicone pad 20 Shore00 for RDRAM memory modules ,Good thermal conductive:1.8W / MK The TIF540-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also

1.8W / MK UL recognized thermal conductive pad 0.5mmT For Telecommunication hardware 20 Shore00 The TIF520-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is

1.8W/mK China company supplied High durability silicone pads ,5.0mmT,20 shore00, for IT infrastructure The TIF5200-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of

1.8W/mK China company supplied silicone sheets ,4.5mmT,20 shore00, for display card,UL 94 V0 The TIF5180-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is

1.8W/mK insulation thermal conductive gap filler ,4.0mmT,20 shore00, for Heat pipe thermal solutions The TIF5160-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of application

20 shore00 professional thermally conductive silicone rubber ,3.5mmT,1.8W/mK , for mother board The TIF5140-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is

1.8W/mK 20 shore00 Moldability for complex parts heat sink pad ,3.0mmT for Memory Modules The TIF5120-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also

20 shore00 Easy release construction heat sink pad 1.8W/mK, 2.5mmT for Automotive electronics The TIF5100-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is

2.0mmT grey high cost-effective 1.8W/mK, 20 shore00 thermal conductive gap pad for Set top boxes The TIF580-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is

1.8W/mK, 20 shore00 thermal conductive pad 1.5mmT grey low cost for power supply The TIF560-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an

Amazing performance 1.0mmT grey thermal conductive pad applied in Audio and video components 1.8W/mK, 20 shore00 The TIF540-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of

0.5mmT Thermal conductive pad grey Highest Conformability silicone Gap Filler Pad 1.8W/mK, 20 shore00 The TIF520-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of application

Grey Color 1.8W / MK Silicone Rubber Thermal Gap Pad TIF500-18-11US For Wireless Routers 20 Shore00 The TIF500-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications,

Grey Color 5W / MK Silicone Rubber Thermal Gap Pad TIF500-50-11S For Wireless Routers The TIF500-50-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an