Thermal Gap Filler

Ultra-soft thermal pad with 2.6W/mK conductivity, ideal for delicate components. Naturally tacky, RoHS & UL compliant. Custom shapes and thicknesses available. Operates from -40 to 200°C.

Ultra-soft thermal pad with 2.6W/mK conductivity, naturally tacky, and compressible for low-stress assembly. Ideal for CPUs, LEDs, and automotive ECUs. UL V-0 rated, custom shapes available. Free samples offered.

Ultra-soft thermal pad with 2.6W/mK conductivity, fiberglass reinforced for durability. Naturally tacky, electrically isolating, and compressible for low-stress assembly. Ideal for CPU, LED, PCB, GPU, SSD. UL V-0 rated, custom shapes available.

Ultra-soft thermal interface material with 2.6W/mK conductivity, low stress, and high tack. Protects sensitive components. RoHS and UL compliant. Custom shapes and thicknesses available.

Ultra-soft 7.5W/m-K thermal pad with self-adhesive for stress-free installation. Protects sensitive components, fills gaps, and reduces contact resistance. UL recognized, RoHS compliant. Custom thicknesses and shapes available.

Ultra-soft 7.5W/m-K thermal pad with self-adhesive for stress-free installation. High thermal conductivity, UL V-0 rated, RoHS compliant. Ideal for CPU/GPU cooling, EV batteries, and 5G base stations. Custom shapes and thicknesses available.

Ultra-soft thermal pad with 6.5W/m-K conductivity, self-adhesive design, and RoHS certification. Ideal for CPU/GPU cooling in PCs, laptops, and power electronics. Custom shapes available. UL V-0 rated.

Ultra-soft thermal pad with 6.5W/mK conductivity and 5500V breakdown voltage. Self-adhesive, RoHS and UL compliant. Ideal for CPU/GPU cooling, EV batteries, and power electronics. Custom shapes and thicknesses available.

TIF 500-65-11ES series offers 6.5W/mK thermal conductivity with ultra-soft compliance for low mounting pressure. Self-adhesive, electrically insulating, and UL94 V-0 rated. Ideal for network communication, EV batteries, and CPU/GPU cooling. Custom shapes and thicknesses available.

TIF®100-40-11E series offers high thermal conductivity of 4.0W/mK, ultra-soft compliance, and excellent insulation. Self-adhesive design ensures easy installation. Ideal for AI processors, servers, and power electronics. Custom shapes available. UL V-0 rated.

TIF 700NU ultra-soft thermal pad with 6.5W/mK conductivity protects delicate components from stress. Self-adhesive, good insulation, UL94 V-0 rated. Ideal for CPU/GPU, EV batteries, and power systems. Custom shapes and thicknesses available.

High-performance thermal silicone pad with 5.0 W/mK conductivity, electrically isolating, soft and compressible. UL94 V0 rated, RoHS compliant, operates from -45°C to 200°C. Available in custom thicknesses and shapes for LED, CPU, and automotive applications.

TIF 100-10UF series thermal pad offers 1.5W/mK conductivity, low hardness, and electrical isolation. UL recognized, RoHS compliant, and customizable in thickness and shape for reliable heat dissipation in LEDs, CPUs, and automotive electronics.

TIF 100-10E series soft silicone pad fills air gaps for efficient heat transfer. Features 1.5W/mK conductivity, UL 94 V0 rating, and custom thickness options. Ideal for CPUs, GPUs, and power electronics.

Soft, compressible thermal gap filler with 1.0W/mK conductivity and electrical isolation. Available in 0.5–5.0mm thicknesses. UL 94 V0 rated, ceramic-filled silicone. Ideal for laptops, desktops, LEDs, and automotive electronics. Custom sizes and die-cut shapes supported.

TIF 700NES series thermal gap filler pad offers 6.5 W/mK conductivity, high compliance, and natural tack. Ideal for telecom, automotive, and LED applications. UL94 V-0 rated, available in custom shapes and thicknesses from 0.5mm to 5mm.

TIF 100-18-11US series thermal pad offers 1.8W/mK conductivity, high compliance, and electrical isolation. Naturally tacky, durable, and available in custom shapes. Ideal for telecom, automotive, and LED applications. UL V-0 rated.

TIF100-20-11S series thermal pad fills air gaps between heating elements and heat sinks. Features 2.0W/mK thermal conductivity, UL recognized, RoHS compliant, and naturally tacky. Available in custom shapes and thicknesses from 0.25mm to 5.0mm for EV battery packs and electronics.

High-density conductive thermal pad with 8.0W/mK thermal conductivity and 1.5mm thickness. Soft, compressible, and naturally tacky for low-stress CPU cooling. UL recognized and RoHS compliant. Custom thicknesses and die-cut shapes available.

Ultra-soft thermal pad with 8.0W/mK conductivity, 1.0mm thickness, and low assembly stress. Conforms to irregular surfaces, naturally tacky, and available in custom thicknesses. UL94 V-0 rated, ideal for memory modules, LED TV, and automotive electronics.