Thermal Gap Filler

TIF®100-40-11E series offers high thermal conductivity of 4.0W/mK, ultra-soft compliance, and excellent insulation. Self-adhesive design ensures easy installation. Ideal for AI processors, servers, and power electronics. Custom shapes available. UL V-0 rated.

TIF 700NU ultra-soft thermal pad with 6.5W/mK conductivity protects delicate components from stress. Self-adhesive, good insulation, UL94 V-0 rated. Ideal for CPU/GPU, EV batteries, and power systems. Custom shapes and thicknesses available.

High-performance thermal silicone pad with 5.0 W/mK conductivity, electrically isolating, soft and compressible. UL94 V0 rated, RoHS compliant, operates from -45°C to 200°C. Available in custom thicknesses and shapes for LED, CPU, and automotive applications.

TIF 100-10UF series thermal pad offers 1.5W/mK conductivity, low hardness, and electrical isolation. UL recognized, RoHS compliant, and customizable in thickness and shape for reliable heat dissipation in LEDs, CPUs, and automotive electronics.

TIF 100-10E series soft silicone pad fills air gaps for efficient heat transfer. Features 1.5W/mK conductivity, UL 94 V0 rating, and custom thickness options. Ideal for CPUs, GPUs, and power electronics.

Soft, compressible thermal gap filler with 1.0W/mK conductivity and electrical isolation. Available in 0.5–5.0mm thicknesses. UL 94 V0 rated, ceramic-filled silicone. Ideal for laptops, desktops, LEDs, and automotive electronics. Custom sizes and die-cut shapes supported.

TIF 700NES series thermal gap filler pad offers 6.5 W/mK conductivity, high compliance, and natural tack. Ideal for telecom, automotive, and LED applications. UL94 V-0 rated, available in custom shapes and thicknesses from 0.5mm to 5mm.

TIF 100-18-11US series thermal pad offers 1.8W/mK conductivity, high compliance, and electrical isolation. Naturally tacky, durable, and available in custom shapes. Ideal for telecom, automotive, and LED applications. UL V-0 rated.

TIF100-20-11S series thermal pad fills air gaps between heating elements and heat sinks. Features 2.0W/mK thermal conductivity, UL recognized, RoHS compliant, and naturally tacky. Available in custom shapes and thicknesses from 0.25mm to 5.0mm for EV battery packs and electronics.

High-density conductive thermal pad with 8.0W/mK thermal conductivity and 1.5mm thickness. Soft, compressible, and naturally tacky for low-stress CPU cooling. UL recognized and RoHS compliant. Custom thicknesses and die-cut shapes available.

Ultra-soft thermal pad with 8.0W/mK conductivity, 1.0mm thickness, and low assembly stress. Conforms to irregular surfaces, naturally tacky, and available in custom thicknesses. UL94 V-0 rated, ideal for memory modules, LED TV, and automotive electronics.

High durability 5.0mm thick silicone thermal pad with 5W/mK conductivity. Fiberglass reinforced for puncture resistance. Naturally tacky, 45 Shore 00 hardness. Ideal for automotive ECUs and power electronics. Custom sizes available.

Soft gap filler with 5W/mK thermal conductivity and 45 Shore00 hardness. UL recognized, electrically isolating, and fiberglass reinforced for durability. Ideal for RDRAM modules, CPUs, and automotive electronics. Custom options available.

High-performance thermal pad with 5.0W/mK conductivity and 45 Shore00 hardness. Electrically isolating, UL recognized, RoHS compliant. Ideal for LED TV, power supplies, and electronics. Custom thicknesses and shapes available.

TIF5140-50-11S is a soft, high-performance gap filler with 5.0W/mK thermal conductivity. Ultra-low modulus ensures low stress and excellent wet-out on irregular surfaces. UL recognized, RoHS compliant, and customizable for demanding electronics applications.

High-performance thermally conductive silicone rubber with 5.0W/mK conductivity and 3.0mm thickness. Fiberglass reinforced for durability, electrically isolating, soft and compressible for low-stress applications. Ideal for motherboards, notebooks, and LED heat sinking. UL94 V0 rated.

TIF5100-50-11S thermal pad offers 5.0W/mK conductivity, 2.5mm thickness, and 45 Shore 00 hardness. Soft, compressible, UL recognized, and ideal for set top boxes, automotive ECUs, and telecom hardware.

High-performance 5.0W/mK thermal conductive silicone pad with 2.0mm thickness and 45 Shore 00 hardness. UL94 V0 rated, electrically isolating, and naturally tacky. Ideal for motherboard, notebook, and IT infrastructure heat transfer applications.

UL recognized thermal gap filler with 5.0W/mK conductivity, 1.5mm thickness, and 45 Shore 00 hardness. Soft, compressible, and fiberglass reinforced for durability. Ideal for LED strips, bars, and heat pipe solutions. Custom sizes available.

High-performance 5.0W/mK thermal gap pad with 1.0mm thickness and 45 Shore 00 hardness. Fills gaps for efficient heat transfer, insulation, and damping. RoHS compliant, naturally tacky, and ideal for LED lighting, routers, and power supplies.