Thermal Gap Filler

TS-TIF100C 3030-11 silicone thermal gap filler offers 3.0W/mK conductivity, soft compressibility, and natural tack for uneven surfaces. Ideal for CPUs, LEDs, and power supplies. UL94 V0 rated, custom thicknesses and die-cut shapes available.

TS-TIF100C 5045-11 series silicone thermal pad fills gaps between heat sources and cooling plates. Features 5.0W/mK conductivity, self-adhesive, soft, and highly compressible. UL94 V0 rated. Custom thicknesses and die-cut shapes available for efficient thermal management.

High-performance 6.0W/mK thermal pad with self-adhesive backing, ideal for filling uneven gaps in LED, CPU, GPU, and EV battery cooling. Highly compressible, soft, and elastic with UL94 V0 rating. Custom thicknesses and die-cut shapes available for OEM applications.

TS-TIF100C 6530-11 series silicone thermal pad fills gaps between components and cooling plates. Features 6.5W/mK conductivity, self-adhesive, high compressibility, and UL94 V0 rating. Available in multiple thicknesses with custom die-cut options for EVs, HPC, and industrial equipment.

TS-TIF100C 8045-11 series silicone thermal pad with 8.0W/mK conductivity fills gaps between components and cooling plates. Self-adhesive, highly compressible, UL94 V-0 rated. Custom thicknesses and die-cut shapes available for high-power electronics.

Ultra-soft thermal pad with 1.5W/mK conductivity, ideal for stress-sensitive components. Features high tack, low contact resistance, and UL V-0 rating. Custom shapes and thicknesses available. Suitable for LED, medical, and UAV applications.

Ultra-soft thermal pad with 2.6W/mK conductivity, ideal for delicate components. Naturally tacky, RoHS & UL compliant. Custom shapes and thicknesses available. Operates from -40 to 200°C.

Ultra-soft thermal pad with 2.6W/mK conductivity, naturally tacky, and compressible for low-stress assembly. Ideal for CPUs, LEDs, and automotive ECUs. UL V-0 rated, custom shapes available. Free samples offered.

Ultra-soft thermal pad with 2.6W/mK conductivity, fiberglass reinforced for durability. Naturally tacky, electrically isolating, and compressible for low-stress assembly. Ideal for CPU, LED, PCB, GPU, SSD. UL V-0 rated, custom shapes available.

Ultra-soft thermal interface material with 2.6W/mK conductivity, low stress, and high tack. Protects sensitive components. RoHS and UL compliant. Custom shapes and thicknesses available.

TIF®100-50-11F series thermal pad offers 5.0W/mK conductivity, soft compressibility, and natural tack. UL recognized and RoHS compliant. Ideal for AI processors, automotive electronics, and LED lighting. Custom shapes and thicknesses available.

Ultra-soft thermal pad with 6.0W/mK conductivity, ideal for protecting sensitive components. UL recognized, RoHS compliant. Custom shapes and thicknesses available for automotive, LED, and telecom applications.

Ultra-soft thermal gap filler with 3.0 W/m-K conductivity and 20 Shore 00 hardness. Fiberglass reinforced, RoHS and UL V-0 rated. Ideal for sensitive electronics, EV batteries, and AI servers. Custom shapes and thicknesses available.

TIF100-30-10S series thermal pad offers 3.0 W/mK conductivity and 65 Shore 00 softness for low-stress assembly. UL V-0 rated, naturally tacky, and customizable in thickness and shape. Ideal for power modules, EV batteries, and LED lighting.

Ultra-soft 7.5W/m-K thermal pad with self-adhesive for stress-free installation. Protects sensitive components, fills gaps, and reduces contact resistance. UL recognized, RoHS compliant. Custom thicknesses and shapes available.

Ultra-soft 7.5W/m-K thermal pad with self-adhesive for stress-free installation. High thermal conductivity, UL V-0 rated, RoHS compliant. Ideal for CPU/GPU cooling, EV batteries, and 5G base stations. Custom shapes and thicknesses available.

Ultra-soft thermal pad with 6.5W/m-K conductivity, self-adhesive design, and RoHS certification. Ideal for CPU/GPU cooling in PCs, laptops, and power electronics. Custom shapes available. UL V-0 rated.

Ultra-soft thermal pad with 6.5W/mK conductivity and 5500V breakdown voltage. Self-adhesive, RoHS and UL compliant. Ideal for CPU/GPU cooling, EV batteries, and power electronics. Custom shapes and thicknesses available.

TIF 500-65-11ES series offers 6.5W/mK thermal conductivity with ultra-soft compliance for low mounting pressure. Self-adhesive, electrically insulating, and UL94 V-0 rated. Ideal for network communication, EV batteries, and CPU/GPU cooling. Custom shapes and thicknesses available.

TIF 200-20-18U series thermal gap pad offers 2.0W/mK conductivity, super soft compliance, and high insulation. Self-adhesive, puncture resistant, and UL94 V-0 rated. Ideal for power electronics, automotive, and new energy applications. Custom shapes available.