Thermal Gap Pad
UL Recognized Thermally Conductive Silicone Gap Filler Pad 3.0 W/mK 1.5mm for Routers CPU
Professional UL recognized silicone gap filler pad with 3.0 W/mK thermal conductivity, 1.5mm thickness, and 18 Shore 00 hardness. Low oil permeability, high softness, and UL94V0 rated. Ideal for automotive electronics, IT infrastructure, and portable devices. Custom sizes available.
1.0mm Silicone Thermal Gap Pad 3.0 W/mK Electrically Isolating for Automotive Electronics
TIF120-30-05US silicone thermal gap pad offers 3.0 W/mK conductivity, 1.0mm thickness, and electrical isolation. Low hardness and high tack reduce contact resistance. Ideal for automotive electronics, power supplies, and memory modules. UL 94 V0 rated.
0.5mm Thermal Conductive Silicone Pad 3.0 W/mK 18 Shore 00 for Display Card GPU
High-performance 0.5mm thick thermal pad with 3.0 W/mK conductivity and 18 Shore 00 hardness. Naturally tacky, electrically insulating, and UL94 V0 rated. Ideal for display cards, CPUs, and automotive electronics. Custom thicknesses available.
Blue Thermal Conductive Gap Pad 1.2 W/mK Hardness 12 Shore 00 for LED Heat Sinking
TIF1200-12-05ES thermal silicone pad offers 1.2 W/mK conductivity, low thermal resistance, and high softness. UL94V0 rated, fiberglass reinforced, and electrically isolating. Ideal for LED BLU, power supplies, and IT equipment. Custom sizes and shapes available.
Ultra Soft Blue Thermal Conductive Gap Pad 1.2W/mK 4.5mm for High Speed Storage Drives
TIF1180-12-05ES thermal pad offers 1.2W/mK conductivity, ultra-soft 12 Shore 00 hardness, and low thermal resistance. Ideal for high-speed mass storage drives, LED TVs, and automotive electronics. UL94V0 rated, operates from -40°C to 160°C, with customizable thickness and easy release construction.
UL Recognized Silicone Thermal Pad 1.2 W/mK 4.0mm for Automotive ECU
UL recognized silicone thermal pad with 1.2 W/mK conductivity and 4.0mm thickness. Soft, compressible, and moldable for low-stress automotive ECU applications. Offers excellent thermal impedance and flame retardancy (V0). Custom thicknesses available.
3.5mm Thermal Conductive Gap Pad 1.2W/mK for GPS Navigation and Portable Devices
Soft, compressible 3.5mm gap pad with 1.2W/mK thermal conductivity. UL recognized, electrically isolating, and offers low-stress vibration dampening. Ideal for GPS, LED power, and automotive ECUs. Custom sizes and adhesive options available.
Blue 1.2 W/mK Thermal Conductive Gap Pad 3.0mm for LED Bar Silicone Filler
High-performance silicone gap pad with 1.2 W/mK thermal conductivity and 3.0mm thickness. Low hardness, electrically isolating, and fiberglass reinforced for durability. Ideal for LED bars, automotive electronics, and power modules. UL94 V-0, RoHS compliant. Custom sizes available.
1.2 W/mK Silicone Thermal Pad 5500 VAC for High Speed Mass Storage Drives
High-performance silicone thermal pad with 1.2 W/mK conductivity and >5500 VAC dielectric breakdown. Features low oil permeability, high softness, and UL94V0 rating. Ideal for mass storage drives, LED, and automotive electronics. Custom thicknesses available.
Thermal Conductive Gap Pad 1.2W/mK 2.0mm for GPS Navigation Portable Devices
TIF180-12-05ES gap pad fills gaps for efficient heat transfer, insulation, and damping. Features 1.2W/mK conductivity, 2.0mm thickness, UL recognized, RoHS compliant. Ideal for GPS, LED power, and automotive ECUs.
1.2 W/mK Blue Thermally Conductive Silicone Rubber 1.5mm for Handheld Electronics
High-performance thermal interface material with 1.2 W/mK conductivity and 1.5mm thickness. UL recognized and RoHS compliant. Effectively reduces thermal resistance between heat source and heatsink. Ideal for handheld portable electronics, CPUs, and memory modules. Custom adhesive and reinforcement options available.
Blue Thermal Gap Filler 1.2W/mK 4.5MHz for CD-ROM DVD-ROM Cooling 1.0mm Thickness
TIF140-12-05ES thermal silicone pad offers 1.2W/mK conductivity, low oil permeability, and high softness. Stable from -40°C to 160°C, UL94V0 rated. Ideal for CD-ROM, DVD-ROM, LED power supplies, and heat pipe solutions. Custom thicknesses available.
Thermal Gap Filler 1.2 W/mK Density 2.0 g/cm³ for RDRAM Memory Modules
Silicone-based thermal gap pad with 1.2 W/mK conductivity and 2.0 g/cm³ density. UL94 V-0 rated, electrically isolating, and fiberglass reinforced for durability. Ideal for RDRAM modules, LED power supplies, and automotive ECUs. Custom thicknesses and die-cut shapes available.
Thermal Gap Pad 3.0 W/mK Silicone Conductive Pad 5.0mm Thickness for Routers
High-performance silicone gap pad with 3.0 W/mK thermal conductivity and 5.0mm thickness. Low hardness, high tack surface reduces contact resistance. RoHS compliant, electrically isolating. Ideal for routers and LED modules.
4.5mm Thick 3.0 W/mK Conductive Silicone Pad for Monitoring Power Box
High-performance silicone pad with 3.0 W/mK thermal conductivity and 4.5mm thickness. Offers excellent vibration dampening, electrical isolation, and UL94 V0 fire rating. Custom thicknesses and hardness available for diverse power applications.
3.0W Gray Thermal Gap Pad 4.0mm Thickness Silicone for IT Infrastructure
High-performance 3.0 W/mK thermal gap pad with 4.0mm thickness, 20 Shore 00 hardness, and gray silicone construction. Naturally tacky, compressible, and moldable for efficient heat transfer in IT infrastructure and electronics. UL 94 V0 rated.
3.5mm Thick Notebook Heat Insulation Silicone Pad 3.0 W/mK Thermal Conductivity 0.35% Outgassing
High-performance silicone pad with 3.0 W/mK thermal conductivity and 0.35% outgassing for notebook heat insulation. Features 3.5mm thickness, 20 Shore 00 hardness, electrical isolation, and UL94 V0 flame rating. Ideal for motherboards, power supplies, and memory modules.
UL RoHS 3.0mm Thermal Gap Pad 20 Shore 00 3.0 W/mK for CPU
High-performance 3.0mm thermal silicone pad with 3.0 W/mK conductivity and 20 Shore 00 hardness. UL94 V-0 and RoHS compliant. Low thermal resistance, high softness, and electrically isolating. Ideal for CPUs, automotive ECUs, and telecom hardware. Custom sizes available.
2.5mm Thermal Gap Pad 3.0 W/mK Easy Release for SMD LED Module Heat Dissipation
Silicone-based thermal gap pad with 3.0 W/mK conductivity and 2.5mm thickness. Low hardness, high tack surface reduces contact resistance. UL 94 V0 rated, operates from -40 to 160°C. Ideal for LED modules, power supplies, and routers.
Fire Rating 94 V0 Thermal Gap Filler 20 Shore 00 3.0 W/mK 2.0mm Thickness
TIF180-30-02US thermal gap filler with UL 94 V0 fire rating, 3.0 W/mK conductivity, and 20 Shore 00 hardness. Naturally tacky, electrically isolating, and ideal for LED power supplies and adapters. Custom sizes and thicknesses available.