Thermal Gap Pad
Blue Thermal Gap Filler 1.2W/mK 4.5MHz for CD-ROM DVD-ROM Cooling 1.0mm Thickness
TIF140-12-05ES thermal silicone pad offers 1.2W/mK conductivity, low oil permeability, and high softness. Stable from -40°C to 160°C, UL94V0 rated. Ideal for CD-ROM, DVD-ROM, LED power supplies, and heat pipe solutions. Custom thicknesses available.
Thermal Gap Filler 1.2 W/mK Density 2.0 g/cm³ for RDRAM Memory Modules
Silicone-based thermal gap pad with 1.2 W/mK conductivity and 2.0 g/cm³ density. UL94 V-0 rated, electrically isolating, and fiberglass reinforced for durability. Ideal for RDRAM modules, LED power supplies, and automotive ECUs. Custom thicknesses and die-cut shapes available.
Thermal Gap Pad 3.0 W/mK Silicone Conductive Pad 5.0mm Thickness for Routers
High-performance silicone gap pad with 3.0 W/mK thermal conductivity and 5.0mm thickness. Low hardness, high tack surface reduces contact resistance. RoHS compliant, electrically isolating. Ideal for routers and LED modules.
4.5mm Thick 3.0 W/mK Conductive Silicone Pad for Monitoring Power Box
High-performance silicone pad with 3.0 W/mK thermal conductivity and 4.5mm thickness. Offers excellent vibration dampening, electrical isolation, and UL94 V0 fire rating. Custom thicknesses and hardness available for diverse power applications.
3.0W Gray Thermal Gap Pad 4.0mm Thickness Silicone for IT Infrastructure
High-performance 3.0 W/mK thermal gap pad with 4.0mm thickness, 20 Shore 00 hardness, and gray silicone construction. Naturally tacky, compressible, and moldable for efficient heat transfer in IT infrastructure and electronics. UL 94 V0 rated.
3.5mm Thick Notebook Heat Insulation Silicone Pad 3.0 W/mK Thermal Conductivity 0.35% Outgassing
High-performance silicone pad with 3.0 W/mK thermal conductivity and 0.35% outgassing for notebook heat insulation. Features 3.5mm thickness, 20 Shore 00 hardness, electrical isolation, and UL94 V0 flame rating. Ideal for motherboards, power supplies, and memory modules.
UL RoHS 3.0mm Thermal Gap Pad 20 Shore 00 3.0 W/mK for CPU
High-performance 3.0mm thermal silicone pad with 3.0 W/mK conductivity and 20 Shore 00 hardness. UL94 V-0 and RoHS compliant. Low thermal resistance, high softness, and electrically isolating. Ideal for CPUs, automotive ECUs, and telecom hardware. Custom sizes available.
2.5mm Thermal Gap Pad 3.0 W/mK Easy Release for SMD LED Module Heat Dissipation
Silicone-based thermal gap pad with 3.0 W/mK conductivity and 2.5mm thickness. Low hardness, high tack surface reduces contact resistance. UL 94 V0 rated, operates from -40 to 160°C. Ideal for LED modules, power supplies, and routers.
Fire Rating 94 V0 Thermal Gap Filler 20 Shore 00 3.0 W/mK 2.0mm Thickness
TIF180-30-02US thermal gap filler with UL 94 V0 fire rating, 3.0 W/mK conductivity, and 20 Shore 00 hardness. Naturally tacky, electrically isolating, and ideal for LED power supplies and adapters. Custom sizes and thicknesses available.
Thermal Gap Pad 3.0 W/mK Silicone Insulation Pad 1.5mm Thickness Specific Gravity 2.9 g/cc for Set Top Boxes
High-performance silicone thermal gap pad with 3.0 W/mK conductivity, 1.5mm thickness, and 2.9 g/cc density. Soft, compressible, and electrically insulating. Ideal for set top boxes, automotive electronics, and IT infrastructure. UL 94 V0 rated. Custom sizes available.
1.0mm Soft Compressible Thermal Pad 3.0 W/mK for Memory Modules
Soft compressible silicone pad with 3.0 W/mK thermal conductivity and 1.0mm thickness. Low stress, electrically isolating, UL94 V0 rated. Ideal for memory modules, motherboards, and power supplies. Custom sizes available.
3.0 W/mK Thermal Gap Pad 0.5mm Thickness for Telecommunication Hardware
High-performance thermal silicone pad with 3.0 W/mK conductivity, low thermal resistance, and high softness. UL94V0 rated, RoHS compliant, and fiberglass reinforced for durability. Ideal for telecom hardware, automotive ECUs, and electronics. Custom thickness options available.
5.0mm Thick 5.0W/mK Thermal Silicone Pad for Audio Video Components
High-performance 5.0mm thick silicone pad with 5.0W/mK thermal conductivity. Fills gaps, insulates, dampens, and seals. RoHS compliant, 94 V0 rated. Ideal for automotive, IT, and consumer electronics.
4.5mm Thick 5.0 W/mK UL Recognized Thermal Gap Pad for Notebook
High-performance thermal gap pad with 5.0 W/mK conductivity and 4.5mm thickness. UL94 V0 rated, ceramic-filled silicone elastomer ensures durability and efficient heat transfer. Ideal for notebooks, motherboards, and power supplies. Custom sizes and shapes available.
Thermal Conductive Silicone Pad 5.0 W/mK 4.0mm Thickness Moldable for LED TV
High-performance thermal pad with 5.0 W/mK conductivity, 4.0mm thickness, and low oil permeability. Soft, compressible, and moldable for complex parts. Operates from -40°C to 160°C, UL94V0 rated. Ideal for LED TV, heat sinks, and memory modules.
TIF1140N-50-10F Thermal Gap Pad 5.0 W/mK 3.5mm Thickness 55 Shore 00 for Handheld Electronics
High durability silicone thermal pad with 5.0 W/mK conductivity and 55±5 Shore 00 hardness. Electrically isolating, low modulus, and conformable for handheld electronics. UL 94 V0 rated. Custom thickness options available.
3.0mm Thick 5.0W/mK Thermal Conductive Heat Sink Pad for LED Strip RoHS UL
High-performance 3.0mm thick thermal pad with 5.0W/mK conductivity. Fills gaps, insulates, and dampens vibration for LED strips and modules. UL94 V-0, RoHS compliant. Custom thicknesses available. Ideal for miniaturized designs.
2.1 g/cm³ Construction Silicone Thermal Pad 5.0 W/mK 2.5mm for Rainproof LED Power
High-performance thermal pad with 5.0 W/mK conductivity and 2.5mm thickness. Features ceramic-filled silicone construction, 94 V0 fire rating, and high tack surface for reduced contact resistance. Ideal for LED power supplies and controllers. Custom sizes available.
Thermal Conductive Pad 5.0 W/mK 2.0mm Thickness for GPS Navigation -40 to 160℃
High cost-effective thermal silicone pad with 5.0 W/mK conductivity and 2.0mm thickness. Features low oil permeability, high softness, UL94V0 rating, and stable -40 to 160℃ performance. Ideal for GPS navigation, automotive electronics, and IT infrastructure. Custom thicknesses available.
5.0W/mK Thermal Conductive Heat Sink Pad 1.5mm Thickness for Memory Modules
Silicone-based thermal gap pad with 5.0W/mK conductivity and 1.5mm thickness. Low hardness, electrically isolating, and compressible for low-stress applications. Ideal for memory modules, motherboards, and power supplies. UL94 V0 rated.