Silicone Thermal Pad

High Compressibility Thermal Pad Ideal Material Cut Into Any Shape Thermal Pad For Medical Devices Product Overview TIF ®400 Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. Key Features

GPU Thermal Pad Offering Excellent Heat Transfer And Electrical Insulation Properties For Battery Pack Thermal Management Company Profile Ziitek Electronic Material and Technology Ltd was founded in 2006 and headquartered in Dongguan, Guangdong. We are a high-tech enterprise specializing in heat conduction, heating, sealing and EMI products. With production bases in Kunshan, Jiangsu, Taiwan Province and Vietnam, we ensure efficient delivery and localized services worldwide.

High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For High Performance Computing Product Overview The TIF® 100N 8085-06 Series is a thermal pad that combines excellent heat dissipation performance with reliable structural support capability. It can fill interface gaps, establish efficient thermal conduction pathways, and provide stable mechanical support for stacked or adjacent electronic components, effectively meeting long-term durability

AI Server Thermal Pad 2.5W/mK Thermal Management For Servers Company Profile Ziitek Electronic Material and Technology Ltd was founded in 2006 and headquartered in Dongguan, Guangdong. We are a high-tech enterprise specializing in heat conduction, heating, sealing and EMI products. With production bases in Kunshan, Jiangsu, Taiwan Province and Vietnam, we ensure efficient delivery and localized services worldwide. Our product system covers thermal interface materials, EMI

Thermal Conductive Pad Offering 6.0W/mK High Thermal Conductivity And Excellent Electrical Insulation The TIF® 100 6050-19 Series is a well-balanced, general-purpose thermal pad offering high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal

Thermal Conductive Silicone Thermal Pad With 3.0W/mK For Heat Management Product Overview The TIF® 100-30-15U Series is an ultra-soft thermal interface material specifically designed to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It effectively addresses issues such as large tolerances, uneven surfaces, and the

Thermal Conductive Pad Designed To Fill Uneven Surfaces And Provide Thermal Interface For Heat Dissipation In Electronics About Ziitek Founded in 2006 and headquartered in Dongguan, Guangdong, Ziitek is a high-tech enterprise specializing in heat conduction, heating, sealing and EMI products. The company has established production bases in Kunshan, Jiangsu, Taiwan Province and Vietnam to ensure efficient delivery and localized services globally. Ziitek's product system covers

2.0W/mK Ceramic Filled Silicone Thermal Pad for AI Processors and Server Applications Product Overview TIF® 100-20-02U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large

Thermal Conductive Pad 1.5W/mK Silicone Thermal Interface Material For Heat Transfer In AI Processors AI Servers Product Overview TIF® 100-19U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision

Durable Silicone Thermal Pad Providing Excellent Thermal Conductivity And Electrical Insulation For Electronic Components Product Overview TIF® 100-16-38UF Series is a structurally supportive thermal pad designed to provide excellent heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat efficiently, and offers mechanical support for stacked components while resisting compressive deformation. This product is ideal

4.0W/mK Thermal Gap Filler Suitable For Thermal Interface Applications In Automotive Industrial And Consumer Electronics Company Profile Dongguan Ziitek Electronic Material and Technology Co., Ltd. (ZIITEK) has been deeply involved in the field of heat conducting materials for many years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery

High Dielectric Strength Silicone-Based Gap Pad Filler For Consumer Electronics Cooling The TIF®100-15-11S Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. Company Profile Ziitek Electronic

Custom 5.0W/mK Silicone Thermal Insulation Pads Thermal Gap Filler Pad For Auto Parts & Battery Pack Sealing About ZIITEK Dongguan Ziitek Electronic Material and Technology Co., Ltd. (ZIITEK) is a high-tech enterprise specializing in thermal conductive materials with years of industry experience. We integrate R&D, production, and sales with headquarters in Dongguan and production bases in Kunshan, Taiwan Province, and Vietnam, ensuring stable global delivery capacity. Our

Thermal Conductive Pad 2.0W/mK Thermal Conductivity Material With Natural Tackiness For Application In Electronic Cooling Product Overview TIF® 100-20-02S Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of

Ultra Performance 10W/mK Thermal Pad Effectively Fill Gaps Pad For High-end Chip Product Description The TIF® 100 10020-11 Series is an ultra-soft thermal interface material specifically designed to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-like softness, achieving a low-stress perfect fit. It effectively addresses issues in high-precision assemblies, including large

Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd . was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat

UL Recognized Premium Soft Thermal Conductivity 1.5W/MK Silicone Thermal Pad For Unmanned Aerial Vehicle (UAV) Product Overview The TIF®100-01S thermal pad is engineered to optimize gap heat transfer, filling spaces between heating and cooling components to complete efficient thermal transfer. This advanced material also provides insulation, damping, and sealing functions, supporting equipment miniaturization and ultra-thin design requirements. Key Features Excellent thermal

Thermal Gap Filler Offering Thermal Conductivity 1.5W/mK For In Electronic Device Heat Management Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating

Pink 1.5W/MK Silica Thermal/Heat Conductive Pads Insulation Sheet For Cpu/Gpu Graphics Card Cooling Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which

High Thermal Conductivity Pad 13.0W/mK Thermal Gap Pad For Between CPU And Heat Sink Company Profile Dongguan Ziitek Electronic Material and Technology Ltd. (ZIITEK) has been deeply involved in the field of heat conducting materials for many years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity is stable and reliable. Mainly