Silicone Thermal Pad

Soft Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Interface Material Products Description TIF®500-50-10US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances

High Temperature Silicone Sheet Heat Resistance Pad Thermally Silicone Pad For AI Processors AI Servers Products Description TIF®500-40-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances

High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors Products Description TIF®500-30-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large

Ultra Soft Thermally Conductive Gap Filler Pads Thermal Pads For Heat Pipe Thermal Solutions And AI Processors Products Description TIF®500-30-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large

Low Compression Stress Thermal GAP PAD Materials For New Energy Vehicle Power Systems Products Description TIF®500-30-05U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces

Low Density Thermal Pad For High Speed Networks And AI Servers Products Description TIS®100-15-11S-D Series is an innovative low-density thermal pad that offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and outstanding ease of use, delivering effective heat transfer and basicphysical protection for a wide range of electronic components while achieving lightweight performance. Features: > Low density > Good

Thermally Conductive And Electrically Conductive Silicone Thermal Pad For LED Lighting Products Description TIS®300-45 Series is a nickel/graphite-filled conductive and thermally conductive silicone sheet, specially developed for thermal management and electromagnetic interference suppression of 3C electronic products, high-frequency signal devices, and precision electromagnetic components. It features excellent thermal conductivity and surface resistivity, while providing

Good Heat Dissipation Ultra Soft 7.5W Silicone Thermal Pad For AI Processors AI Servers Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be

Multiple Thickness CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating

Thermal Silicone Pad 7.5W High Conductivity Heat Dissipation Sheet For AI Server Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best

Ultra Soft Termal Pad Manufacturer High Temperature Silicon Thermal Pad For AI Servers AI Processors Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating

Good Insulation Ultra High Thermal Conductivity Gap Filler Pad For AI Servers Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others. Certifications: ISO9001:2015 ISO14001: 2004

High Thermally Conductive 15W/MK Gray Thermally Gap Pads For 5G Base Stations Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can

Low Compression Stress 6.5W Soft Thermal GAP PAD Materials For AI Processors AI Servers Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines

High Electrical Insulation And Self-Adhesiveness Thermal Pad For 5G Aerospace AI AIoT AR/VR/MR/XR Products description The TIF®500 Series is a well-balanced,general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an

Extremely Soft Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad Products description The TIF®200-04ES Series is a compound thermal interface material that combines good thermal conductivity, reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength, effectively preventing circuit short circuits. Its soft characteristic

Low Volatility Thermal Pad 100x100mm Highly Efficient Thermal Conductivity 4.0 W/MK Heat Resistant High Temperature Products description The TIF®100L 4035-06 Series is a soft, low-volatility thermal pad designed specifically for demanding application environments. While providing high thermal conductivity, it significantly reduces the content of volatile silicones. Its high flexibility allows it to fill uneveninterfaces effectively,achieving ultra-low thermal resistance and

Ultra Soft And Good Compressibility Thermally Conductive Gap Filler Pads For Power Electronics Robot And AI Servers Products description TIF®100-66U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high

Good Insulation Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers Products description TIF®100-50-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances,

Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Network Communications Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and