Heat Sink Thermal Pad
3.5mm Heat Sink Insulation Pad Easy Release Construction Silicone For AD DC Power Adapters
3.5mm Easy Release Construction Silicone Pads for AD-DC Power Adapters Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong
Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure
-40 to 160℃ Moldability for Complex Parts Conductive Pads for IT Infrastructure Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF100-10UF-Datasheet-REV02.pdf Ziitek TIF1120-10UF use a special process, with silicone as the base material, adding thermal
Ziitek TIF1100-10UF Thermal Silicone Pad 2.5mm Thickness 75 Shore 00 Hardness 1.5 W/mK Conductivity
High-performance thermal silicone pad with 1.5 W/mK thermal conductivity and 75 Shore 00 hardness. This 2.5mm thick thermal interface material provides reliable heat dissipation for mainboards, laptops, and power supplies with UL94V0 certification and excellent moldability for complex components.
2.0mm Thermal Conductive Gap Pad with 1.5 W/mK Conductivity for LED Lamps and Electronics Cooling
Ziitek TIF180-10UF thermal pad offers 1.5 W/mK thermal conductivity and 2.0mm thickness for efficient heat dissipation. Features natural tackiness, 75 Shore 00 hardness, and electrical isolation. Ideal for LED lighting, electronics cooling, and thermal management applications with customizable options available.
Ziitek TIF160-10UF Thermal Conductive Pads 1.5 W/mK with 1.5mm Thickness for Display Cards and Electronics
Ziitek TIF160-10UF thermal conductive pads deliver 1.5 W/mK thermal conductivity with 1.5mm standard thickness. These ceramic-filled silicone pads provide excellent vibration dampening, electrical isolation up to 5500 VAC, and continuous operation from -40 to 160℃. Ideal for automotive ECUs, telecommunications, and display card cooling applications.
TIF140-10UF Thermal Interface Pad 1.0mm Thickness 1.5 W/mK Thermal Conductivity for Routers and LED Applications
Ziitek TIF140-10UF thermal interface pad features 1.5 W/mK thermal conductivity and 1.0mm thickness with dielectric constant of 3.9 @ 1MHz. This RoHS compliant gray silicone pad provides electrical isolation, high durability, and supports equipment miniaturization for routers, LED lighting, and electronic cooling applications.
Ziitek TIF120-10UF Thermal Conductive Silicone Pad 0.5mm Thickness 1.5 W/mK for Power Box Monitoring
High-performance thermal interface material with 2.2 g/cc specific gravity and 0.5mm thickness. Features 1.5 W/mK thermal conductivity, 75 Shore 00 hardness, and fiberglass reinforcement. UL recognized and RoHS compliant for LED power supplies, monitoring systems, and industrial applications.
TIF1200-30-06UF Thermal Silicone Pad 5.0mm Thickness 3.0 W/mK Conductivity for Electronics Cooling
High-performance thermal silicone pad with 3.0 W/mK conductivity and 5.0mm thickness designed for routers and electronic devices. Features high tack surface to reduce contact resistance, UL94V0 certification, and excellent moldability for complex components. Operates reliably from -40°C to 160°C with superior thermal management for automotive, IT, and consumer electronics applications.
Ziitek TIF1180-30-06UF 4.5mm Thermal Gap Pad with 3.0 W/mK Conductivity for Memory Modules
Silicone-based thermal gap pad with 3.0 W/mK thermal conductivity and 4.5mm thickness. Features natural tackiness, electrical isolation, and excellent conformability for memory modules, motherboards, and power supplies. Available in multiple thicknesses with -40 to 160℃ operating range and >5500 VAC dielectric strength.
4.0mm Thermal Pad with 3.0 W/mK Conductivity for LED Ceiling Lamps and Electronics Cooling
Ziitek TIF1160-30-06UF thermal pad offers 3.0 W/mK thermal conductivity and 4.0mm thickness for efficient heat dissipation in LED lighting applications. Features electrical isolation, vibration dampening, and custom die-cut options. Certified quality with free samples available for industrial and commercial use.
Ziitek TIF1140-30-06UF Electrically Isolating Conductive Heat Sink Pad 3.5mm Thickness 3.0 W/mK Thermal Conductivity
Professional 3.5mm thick electrically isolating conductive heat sink pads with 3.0 W/mK thermal conductivity. Ideal for display cards, automotive ECUs, and telecommunications hardware. Features high durability, UL certification, and excellent electrical insulation properties for reliable thermal management solutions.
3.0mm Thermal Pad with 3.0 W/mK Ceramic-Filled Silicone Elastomer for Routers and LED Systems
High-performance thermal interface material featuring 3.0mm thickness and 3.0 W/mK thermal conductivity. This ceramic-filled silicone elastomer provides excellent heat dissipation for routers, LED systems, and electronic devices. RoHS compliant, UL recognized, and fiberglass reinforced for durability. Custom solutions available from experienced thermal engineering specialists.
Ziitek TIF1100-30-06UF 2.5mm Thermal Silicone Pad with 3.0 W/mK Conductivity for AC-DC Power Adapters
High-performance 2.5mm thermal silicone pad with 3.0 W/mK thermal conductivity, UL94 V-0 certification, and operating range of -40°C to 160°C. Ideal for LED power supplies, AC-DC adapters, and electronic cooling applications. Features low thermal resistance, high compliance, and excellent moldability for complex components.
Ziitek TIF180-30-06UF Thermal Pad 2.0mm Thickness 3.0 W/mK for Automotive Electronics
High-performance silicone thermal pad with 3.0 W/mK conductivity and 2.0mm thickness. Features low 75±5 Shore 00 hardness for excellent conformability, electrical isolation, and natural tackiness. Ideal for automotive electronics, IT infrastructure, and portable devices with temperature range from -40 to 160℃.