CPU Thermal Pad

High-performance TIF580US thermal pad with 2.6W/mK conductivity and 2.0mm thickness for efficient CPU and motherboard cooling. Features ceramic-filled silicone construction, UL 94 V0 fire rating, and comprehensive quality certifications including ISO9001:2015. Ideal for electronics requiring reliable thermal management solutions.

High-performance thermal pad with 2.6W/mK conductivity and 1.5mm thickness for efficient CPU and motherboard cooling. Features ceramic-filled silicone construction, UL 94 V0 fire rating, and multiple international certifications including ISO9001 and IATF16949. Ideal for electronics requiring reliable thermal management.

High-performance thermal pad with 2.6W/mK conductivity and 1.0mm thickness designed for motherboard and CPU cooling. Features UL 94 V0 fire rating, broad hardness options, and easy installation. Certified with ISO9001, IATF16949, and IECQ standards for reliable thermal management in electronic devices.

High-performance TIF500 thermal pad with 2.6 W/mK thermal conductivity and electrical isolation properties. Available in thicknesses from 0.5mm to 5.0mm, this violet ceramic-filled silicone rubber material provides excellent heat management for electronic devices including portable electronics, storage devices, and audio/video components.

High-performance TIF500S thermal pad with 3.2 W/mK conductivity and electrical isolation properties. Ideal for CPU cooling, portable electronics, and storage devices. Available in thicknesses from 0.25mm to 5.08mm with pressure-sensitive adhesive options. Operating range -40°C to 160°C with >5500 VAC dielectric strength.

High-performance TIF500-30-11U thermal pad delivers 3.0W/mK thermal conductivity with electrical isolation for CPU cooling. Features UL94-V0 flame rating, -40°C to 160°C operating range, and customizable thickness from 0.5mm to 5.0mm. Ideal for electronics, storage devices, and portable applications with competitive pricing and quality assurance.

High-performance grey thermal pad with 5.0W/mK thermal conductivity and electrical isolation up to 5500 VAC. Available in thicknesses from 0.25mm to 5.0mm with flame rating 94-V0 and temperature range -40°C to 160°C. Ideal for mass storage, portable electronics, and audio/video components requiring efficient heat management.

High-performance CPU thermal pad with 1.8 W/mK thermal conductivity and electrical isolation up to 5500 VAC. Blue ceramic-filled silicone rubber construction provides excellent heat management for electronic devices. Features UL 94-V0 flame rating, -40°C to 160°C operating range, and available in thicknesses from 0.5mm to 5.0mm for various applications.

High-performance TIF500-40-11US thermal pad delivers 4.0W/mK thermal conductivity for efficient heat dissipation in electronic devices. Features electrical isolation, natural tackiness, and compressible design for low-stress applications. Available in thicknesses from 0.5mm to 5.0mm with custom die-cut options and pressure-sensitive adhesives.

High-performance thermal interface material with 5.0 W/mK conductivity and UL94 V-0 flame rating. This ceramic-filled silicone pad provides excellent heat transfer for electronic devices with thickness options from 0.5mm to 5.0mm. Features electrical isolation, -40°C to 160°C operating range, and customizable adhesive options for various cooling applications.

High-performance thermal interface pad with 3.0 W/mK thermal conductivity and UL 94-V0 flame rating. Available in thicknesses from 0.5mm to 5.0mm with pressure-sensitive adhesive options. Ideal for CPU cooling, portable electronics, and thermal management applications requiring efficient heat dissipation and electrical isolation.