Optical Coating Equipment
Dielectric Films Optical Coating Equipment PVD Magnetron Sputter Deposition Machine
Dielectric Films Optical Coating Equipment Ar N2 O2 PVD Magnetron Sputtering Deposition Applications Applications Specific Purpose Material Type Semiconductor IC, LSI electrode, wiring film AI, Al-Si, Al-Si-Cu, Cu, Au, Pt, Pd, Ag VLSI memory electrode Mo, W, Ti Diffusion barrier film MoSix, Wsix, TaSix,, TiSx, W, Mo, W-Ti Adhesive film PZT(Pb-ZrO2-Ti) , Ti, W Display Transparent conductive film ITO(In2O; -SnO2) Electrode wiring film Mo, W, Cr, Ta, Ti, Al, AlTi, AITa
Self-developed high-end optical coating equipment with 1200mm*500mm(customized)
Self-developed high-end optical coating equipment with 1200mm*500mm(customized) Working principle Atomiclayer deposition (ALD) is a method by which a substance can be deposited on a substrate layer by layer in the form of a single atomic film. Specification parameter model ALD1200-500 Coating film system AL2O3,TiO2,ZnO and etc. Coating temperature range Normal temperature-500℃ Coating vacuum chamber dimensions Inner diameter 1200mm, height 500mm(customizable) Vacuum chamber
Trimethylaluminum AL2O3 TiO2 ZnO ALD Atomic Layer Deposition Coating Machine
ALD Atomic Layer Deposition Applications Applications Specific Purpose ALD Material Type MEMS devices Etching barrier layer Al2O3 Protective layer Al2O3 Anti-bonding layer TiO2 Hydrophobic layer Al2O3 Bonding layer Al2O3 Wear-resistant layer Al2O3, TiO2 Anti-short circuit layer Al2O3 Charge dissipation layer ZnO: Al Electroluminescent display Luminous layer ZnS: Mn / Er Passivation layer Al2O3 Storage materials Ferroelectric materials HfO2 Paramagnetic materials Gd2O3, Er2O3,
Dielectric Films Magnetron Sputtering Physical Vapor Deposition Coating Machine
Dielectric Films Optical Coating Equipment Ar N2 O2 PVD Magnetron Sputtering Deposition Applications Applications Specific Purpose Material Type Semiconductor IC, LSI electrode, wiring film AI, Al-Si, Al-Si-Cu, Cu, Au, Pt, Pd, Ag VLSI memory electrode Mo, W, Ti Diffusion barrier film MoSix, Wsix, TaSix,, TiSx, W, Mo, W-Ti Adhesive film PZT(Pb-ZrO2-Ti) , Ti, W Display Transparent conductive film ITO(In2O; -SnO2) Electrode wiring film Mo, W, Cr, Ta, Ti, Al, AlTi, AITa
Dielectric Films Optical Coating Equipment Ar N2 O2 PVD Magnetron Sputtering Deposition
PVD Magnetron Sputtering Deposition Applications Applications Specific Purpose Material Type Semiconductor IC, LSI electrode, wiring film AI, Al-Si, Al-Si-Cu, Cu, Au, Pt, Pd, Ag VLSI memory electrode Mo, W, Ti Diffusion barrier film MoSix, Wsix, TaSix,, TiSx, W, Mo, W-Ti Adhesive film PZT(Pb-ZrO2-Ti) , Ti, W Display Transparent conductive film ITO(In2O; -SnO2) Electrode wiring film Mo, W, Cr, Ta, Ti, Al, AlTi, AITa Electroluminescent film ZnS-Mn, ZnS-Tb, CaS-Eu, Y2O3, Ta2O5,
Metal Film Metal Oxide AIN PVD Optical Coating Equipment Physical Vapor Deposition Sputtering Machine
PVD Magnetron Sputtering Deposition Applications Applications Specific Purpose Material Type Semiconductor IC, LSI electrode, wiring film AI, Al-Si, Al-Si-Cu, Cu, Au, Pt, Pd, Ag VLSI memory electrode Mo, W, Ti Diffusion barrier film MoSix, Wsix, TaSix,, TiSx, W, Mo, W-Ti Adhesive film PZT(Pb-ZrO2-Ti) , Ti, W Display Transparent conductive film ITO(In2O; -SnO2) Electrode wiring film Mo, W, Cr, Ta, Ti, Al, AlTi, AITa Electroluminescent film ZnS-Mn, ZnS-Tb, CaS-Eu, Y2O3, Ta2O5,
ALD Al2O3 Optical Coating Equipment Coating Size 200×200mm
ALD Atomic Layer Deposition Applications Applications Specific Purpose ALD Material Type MEMS devices Etching barrier layer Al2O3 Protective layer Al2O3 Anti-bonding layer TiO2 Hydrophobic layer Al2O3 Bonding layer Al2O3 Wear-resistant layer Al2O3, TiO2 Anti-short circuit layer Al2O3 Charge dissipation layer ZnO: Al Electroluminescent display Luminous layer ZnS: Mn / Er Passivation layer Al2O3 Storage materials Ferroelectric materials HfO2 Paramagnetic materials Gd2O3, Er2O3,
TiO2 Al2O3 Optical Coating ALD Deposition Equipment ISO
ALD Atomic Layer Deposition Applications Applications Specific Purpose ALD Material Type MEMS devices Etching barrier layer Al2O3 Protective layer Al2O3 Anti-bonding layer TiO2 Hydrophobic layer Al2O3 Bonding layer Al2O3 Wear-resistant layer Al2O3, TiO2 Anti-short circuit layer Al2O3 Charge dissipation layer ZnO: Al Electroluminescent display Luminous layer ZnS: Mn / Er Passivation layer Al2O3 Storage materials Ferroelectric materials HfO2 Paramagnetic materials Gd2O3, Er2O3,
TiO2 Al2O3 ALD Atomic Layer Deposition Optical Coating Equipment ISO
ALD Atomic Layer Deposition Applications Applications Specific Purpose ALD Material Type MEMS devices Etching barrier layer Al2O3 Protective layer Al2O3 Anti-bonding layer TiO2 Hydrophobic layer Al2O3 Bonding layer Al2O3 Wear-resistant layer Al2O3, TiO2 Anti-short circuit layer Al2O3 Charge dissipation layer ZnO: Al Electroluminescent display Luminous layer ZnS: Mn / Er Passivation layer Al2O3 Storage materials Ferroelectric materials HfO2 Paramagnetic materials Gd2O3, Er2O3,