HDI circuit board FR4 TG170 substrate ENIG 2u' 10 Layer PCB
HDI circuit board FR4 TG170 substrate ENIG 2u' 10 Layer PCB
PCB Specifications:
Part NO: S10E5012A0
Layers: 10Layer
Surface Finished: Immersion gold 2u'
Material: FR4
Thickness: 1.8mm
PCB Size: 154mm*143mm
Finished copper: 1OZ
Solder Mask colour: Green
Silkscreen colour: White
Blind hole size: 0.127mm (1-2/9-10)
Buried hole size:0.127mm (2-3/2-9/8-9)
Though hole size: 0.3mm (1-10)
No. of PP: 8pcs PP
Certificates: UL/94V-0/ISO
Our Product Categories:
| Our Product Categories | ||
| Material Kinds | Layer Counts | Treatments |
| FR4 | Single Layer | HASL Lead Free |
| CEM-1 | 2 Layer/Double Layer | OSP |
| CEM-3 | 4 Layer | Immersion Gold/ENIG |
| Aluminum Substrate | 6 Layer | Hard Gold Plating |
| Iron Substrate | 8 Layer | Immersion Silver |
| PTFE | 10 Layer | Immersion Tin |
| PI Polymide | 12 Layer | Gold fingers |
| AL2O3 Ceramic Substrate | 14 Layer | Heavy copper up to 8OZ |
| Rogers, Isola high frequency materials | 16 Layer | Half plating holes |
| Halogen free | 18 Layer | HDI Laser drilling |
| Copper based | 20 Layer | Selective immersion gold |
| 22 Layer | immersion gold +OSP | |
| 24 Layer | Resin filled in vias | |
FAQ:
Q:what is HDI PCB?
A:
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Definition of a High-Density Interconnect (HDI) Printed Circuit Board
High-density interconnect, or HDI, circuit boards are printed circuit boards with a higher wiring density per unit area than traditional printed circuit boards. In general, HDI PCBs are defined as PCBs with one or all of the following: microvias; blind and buried vias; built-up laminations and high signal performance considerations. Printed circuit board technology has been evolving with changing technology that calls for smaller and faster products. HDI boards are more compact and have smaller vias, pads, copper traces and spaces. As a result, HDIs have denser wiring resulting in lighter weight, more compact, lower layer count PCBs. Rather than using a few PCBs in a device, one HDI board can house the functionality of the previous boards used.
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Benefits of HDI Printed Circuit Boards
The primary benefit of HDI printed circuit boards is the capability to “do more with less”; with copper-etching technology continuously refined for better precision, it became possible to combine functionalities of multiple PCBs into one HDI PCB.
Shortening the distance between devices and trace spaces, HDI PCBs allow for deployment of a large number of transistors for better performance in electronics while lowering power consumption. Signal integrity is also improved due to the shorter distance connections and lower power requirements. Other performance improvements over conventional PCBs include stable voltage rail, minimal stubs, lower RFI/EMI, and closer ground planes and distributed capacitance.
Additionally, consider using a HDI printed circuit board for the following benefits:
- Cost-effectiveness: when properly planned out, overall costs are reduced due to the lower number of necessary layers and smaller sizes/fewer number of needed boards when compared to standard PCBs.
- Faster time-to-market: Design efficiencies in HDI PCB production mean faster time-to-market. Because of the easy placement of components and vias and electrical performance, it takes a shorter amount of time to go through the design and testing process for HDI PCBs.
- Better reliability: Microvias have much better reliability than typical through holes due to the use of a smaller aspect ratio; they are more dependable than through holes, granting HDIs outstanding performance with better materials and parts.
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High-Density Interconnect Printed Circuit Board Structures
Depending on the design requirements, HDI Printed Circuit Boards can utilize different layering methods to achieve the desired performance.
HDI PCB (1+N+1): Simplest HDI
- This structure of HDI PCB contains 1 “build-up” of high-density interconnection layers, suitable for BGA with lower I/O counts.
- It has fine lines, microvia and registration technologies capable of 0.4 mm ball pitch, excellent mounting stability and reliability, and may contain copper filled via.
- Applications: Cell phone, MP3 Player, GPS, Memory Card.
Fig.1: HDI PCB (1+N+1)
HDI PCB (2+N+2): Moderate Complex HDI
- This structure of HDI PCB contains 2 or more “build-up” of high-density interconnection layers; microvias on different layers can be staggered or stacked; Copper filled stacked microvia structures are commonly seen in challenging designs that demand high level signal transmission performance.
- These are suitable for BGA with smaller ball pitch and higher I/O counts and can be used to increase routing density in a complicated design while maintaining a thin finished board thickness.
- Applications: Cell phone, PDA, game console, portable video recording devices.
Fig.2: HDI PCB (2+N+2)
ELIC (Every Layer Interconnection): Most Complex HDI
- In this HDI PCB structure, all the layers are high-density interconnection layers which allow the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures.
- This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices while producing superior electrical characteristics.
- Applications: Cell phone, ultra-mobile PC, MP3, GPS, Memory cards, small computer devices.
Fig.3: ELIC (Every Layer Interconnection)
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