Thermal Pad

TIF100-18-01US thermally conductive silicone pad fills air gaps between heat sources and sinks. With 1.8W/mK conductivity, 18 Shore 00 hardness, and UL V0 rating, it enhances thermal efficiency and durability. Custom thicknesses and die-cut shapes available.

High-performance silicone thermal pad with 1.5W/mK conductivity, low thermal resistance, and high softness. UL94 V-0 rated, works from -40°C to 200°C. Ideal for GPU, SSD, CPU, and LED cooling. Custom thickness and die-cut options available.

High-performance thermal pad with 7.5W/mK conductivity, low hardness, and high tack for minimal contact resistance. UL 94 V0 rated, electrically isolating, and customizable in thickness from 0.5mm to 5.0mm. Ideal for LEDs, memory modules, and automotive electronics.

Ultra-soft thermal pad with 1.8 W/m-K conductivity, ideal for delicate components. Self-adhesive, good insulation, and V-0 flame rated. Custom shapes and thicknesses available. Suitable for CPUs, LEDs, and IT infrastructure.

Ultra-soft thermal pad with 2.0 W/m-K conductivity, 65 Shore 00 hardness, and UL V-0 rating. Protects delicate components from mechanical stress. RoHS compliant, customizable thickness from 0.25mm to 5.0mm. Ideal for high-speed drives, LEDs, and automotive electronics.

Ultra-soft thermal pad with 2.0 W/m-K conductivity, ideal for stress-sensitive components. UL V-0 rated, customizable thickness and shape. Low hardness ensures perfect fit on uneven surfaces. Suitable for CPUs, LEDs, power supplies, and more.

TIF500-40-11U is a soft, compressible silicone thermal pad with 4.0W/mK conductivity. It offers excellent vibration dampening, electrical isolation, and UL recognition. Ideal for high-speed mass storage, power supplies, and automotive ECUs. Custom thicknesses and die-cut shapes available.

TIF100-10-02S thermal interface pad features 1.5 W/m-K thermal conductivity and UL 94 V-0 flame rating. This ceramic-filled silicone elastomer provides excellent heat transfer for LED lighting, power adapters, and electronic devices. Available in thicknesses from 0.5mm to 5.0mm with natural adhesive properties and custom die-cut options.

High thermal conductivity 4.0W/mK with low volatility silicone. Soft, flexible pad fills uneven interfaces for ultra-low thermal resistance. Ideal for aerospace, automotive, and 5G. UL V-0 rated, custom sizes available.

The TIF100-50-05S thermal pad offers 5.0W/mK conductivity, soft compressibility, and high tack for low-stress applications. Ideal for telecom hardware, LED lighting, and automotive ECUs. UL V-0 rated, customizable thickness from 0.25mm to 5.00mm, and available with adhesive or reinforcement options.

Ultra-soft thermal pad with 6.5W/mK conductivity, 65 Shore 00 hardness, and V-0 flame rating. Protects precision components from mechanical stress. Custom shapes and thicknesses available. Ideal for AI servers, CPUs, and power modules.

High thermal conductivity 4.0W/mK with softness and self-adhesive properties. Ideal for CPU/GPU cooling, LED, and EV batteries. UL94 V-0 rated, custom shapes available. Reliable thermal management solution.

Ultra-soft thermal interface pad with 1.8W/mK conductivity, available in 0.5-5.0mm thickness range. Features natural tackiness, RoHS compliance, UL recognition, and excellent compressibility for low-stress applications. Ideal for CPU cooling, automotive electronics, power supplies, and semiconductor test equipment.

Ziitek TIF100-50-11F thermal pad offers 5.0W/mK conductivity with ultra-soft 60±5 Shore 00 hardness. Features natural tackiness, electrical isolation, UL94 V0 rating, and thickness options from 0.5mm to 5.0mm. Ideal for LED systems, power adapters, routers, and semiconductor test equipment with -40 to 160℃ operating range.