Thermal Pad

TIF100-12-66U silicone thermal pads provide excellent 1.5W/m-K thermal conductivity for efficient heat dissipation in electronic applications. Features include natural adhesion, RoHS compliance, UL 94 V-0 flame rating, and availability in standard 8x16 inch sheets with custom die-cut options. Ideal for LED lighting, power adapters, and cooling systems.

Ziitek TIF100-45-56S silicone thermal pad delivers 4.5W/mK thermal conductivity with 45 Shore 00 hardness. Features natural tackiness, electrical isolation, UL94 V0 fire rating, and custom die-cut options. Ideal for semiconductor test equipment, LED systems, and power applications.

TIF100-66U thermal conductive pads feature 1.2W/mK thermal conductivity and thickness range from 0.25mm to 5.0mm. These ceramic-filled silicone elastomer pads provide excellent heat transfer for CPUs, GPUs, and electronic components. RoHS compliant, UL recognized, and available with pressure-sensitive adhesive options for various industrial applications.

2.8W AI Server Ultra Soft Thermal Pads High Quality Thermal Conductivity Insulated Pad Product descriptions TlF®500-28-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely_sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as

Extremely Soft Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad Product descriptions The TIF®200-04ES Series is a compound thermal interface material that combines good thermal conductivity, reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength, effectively preventing circuit short circuits. Its soft characteristic

TIF100-66U Ultra Soft And Good Compressibility 1.5W Thermally Conductive Gap Filler Pads For 5G Aerospace AI Product descriptions TlF®100-66U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision

TIF500-40-11U 5.0W/MK Heat Transfer Thermal Silicone Gel Pad Soft Thermal Pad For AI Processors Cooling Product descriptions TIF®500-50-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress.This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances

TIF500-50-11E High Performance Thermal Pad Soft Silicone Thermal Cooling Pad For AI Processors Cooling Product descriptions TIF®500-50-11E Series is a well-balanced, general-purpose thermal pad. It offers High thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It

TIF500-50-10U Soft Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Interface Material Product descriptions TIF®500-50-10U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as

TIF®600P Premium Soft Silicone Thermal Pad For AI Processors The TIF®600P Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness . This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat

TIF600G Good Insulation Performance 6W/MK Thermal Conductivity Thermal Pad For AI Processors The TIF®600G Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness . This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for

TIF500-50-11US Thermal Silicone Pad 5.0W, High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices The TIF®500-50-11US Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve a perfect fit with low stress.It is suitable for solving problems such as large

TIF100-20-10F Various Thicknesses Thermal Conductive Gap Pad For Automotive IT Infrastructure Products description Ziitek TIF®100-20-10F series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF®100-20-02U is an electrically isolating material, which allows its use in applications requiring isolation

TIF100-20-11PSA Silicone Thermal Pad With Thermal Conductivity 1.2W/M.K Work For Computer Laptop Desktop CPU Cooling Products description Ziitek TIF™100-20-11PSA series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features: > Good

TIF100-20-50U Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Laptop Desktop GPU Computer Products description Ziitek TIF™100-20-50U series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF100-20-50U is an electrically isolating material, which allows its

TIF100-65-11ES Premium Soft CPU Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs Product descriptions TIF®100-65-11ES Series thermally conductive interface materials are applied to fillthe air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating

TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module Product descriptions TlF100-18-01US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire

TIFTM100-07S Silicone Thermal Pad Gpu SSD Thermal Pad Product descriptions TlFTM100-07S Series thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductivity 1.5W/mK > Naturally tacky needing no furtheradhesive coating > Soft and Compressible for low stress

TIF600P Premium Soft Silicone Thermal Pad For Advanced Cooling Needs​ Product descriptions TlF600P Series thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductivity 6.0W/mK > Naturally tacky needing no furtheradhesive coating > Soft and Compressible for

TIF700P Thermal Pad GPU CPU Heatsink Cooling Conductive Silicone Thermal Gap Filler Product descriptions TlF®700P is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive 7.5W/mK > Outstanding thermal