Thermal Pad

TIF300 series silicone thermal pads offer 3.0W/m-K conductivity, soft compressibility, and natural tack for easy assembly. Ideal for LED, power adapters, and automotive electronics. UL V-0 rated, electrically isolating, and available in custom thicknesses and die-cut shapes.

High-performance thermal pad with 1.5 W/mK conductivity, naturally tacky, soft and compressible for uneven surfaces. UL V-0 rated, electrically isolating, available in custom thicknesses and die-cut shapes. Ideal for LED, power adapters, and automotive electronics.

Factory custom size thermal pad with 1.2W/mK conductivity, UL recognition, and RoHS compliance. Ideal for CPU, GPU, LED systems, and electronic cooling applications. Available in thickness range 0.5mm to 5.0mm with pressure-sensitive adhesive options for various industrial uses.

High-performance thermal silicone pad with 6.0W/mK conductivity for efficient heat sink cooling. Features UL94 V0 fire rating, natural adhesion, and thickness options from 0.5mm to 5.0mm. Ideal for LED lighting, power adapters, routers, and semiconductor test equipment with customizable die-cut shapes.

High-performance thermal pad with 4.0W/mK conductivity for GPU and CPU cooling applications. Features natural tackiness, RoHS compliance, UL recognition, and available in thicknesses from 0.5mm to 5.0mm. Ideal for semiconductor test equipment, motherboards, LED systems, and portable devices requiring efficient heat dissipation.

Ultra-soft silicone thermal conductive gap filler pad with 3.0W/mK thermal conductivity and 45 Shore 00 hardness. Features natural tackiness, RoHS compliance, UL recognition, and excellent vibration dampening. Available in thicknesses from 0.5mm to 5.0mm for CPU, LED, and electronic cooling applications.

Ultra-soft silicone thermal conductive pad with 2.5W/mK thermal conductivity and 60 Shore 00 hardness. Features natural tackiness, excellent vibration dampening, and electrical isolation. RoHS compliant and UL recognized for semiconductor, CPU, LED, and electronics cooling applications.

Ultra-soft silicone thermal pad with 2.0W/m-K conductivity and 20 Shore 00 hardness for low-stress applications. Features natural tackiness, RoHS compliance, UL recognition, and excellent conformability to irregular surfaces. Available in thicknesses from 0.5mm to 5.0mm with custom die-cut shapes and adhesive options.

TIF100-10-02F silicone thermal pad offers 1.5 W/mK thermal conductivity with thickness range of 0.5-5.0mm. Features UL94 V-0 flame rating, -40°C to 160°C operating temperature, and excellent dielectric properties. Ideal for electronics cooling in IT infrastructure, LED power supplies, and portable devices.

Ultra-soft thermal pad with 3.0W/mK conductivity, self-adhesive design, and excellent insulation. Ideal for protecting sensitive components in EVs, power tools, and CPUs. UL94 V-0 rated, customizable thickness from 0.25mm to 5.00mm. Factory direct.

Ultra-soft 3.0W/m-K thermal pad with near-fluid softness for low-pressure mounting. Fills gaps perfectly, eliminates air resistance, and protects sensitive components. Self-adhesive, V-0 rated, and available in custom shapes. Ideal for 5G, EV, servers, and industrial electronics.

TIF100-20-19S soft thermal pad offers 2.0W/mK thermal conductivity and electrical insulation. Self-adhesive, good softness, and UL94 V-0 rated. Ideal for AI servers, CPUs, and power modules. Custom shapes and thicknesses available.

TIF®200-15-27E series combines 3.0 W/mK thermal conductivity with ≥5500V breakdown voltage for reliable electrical isolation. Soft, self-adhesive, and puncture-resistant, it fills uneven gaps to protect precision components. UL94 V-0 rated, ideal for EV, power devices, and AI processors. Custom shapes available.

High-performance thermal pad with 5.0W/mK conductivity and UL-94 V0 flame rating. Ultra-soft, self-adhesive design ensures excellent conformity and heat transfer for AI servers, GPUs, and power electronics. RoHS compliant, customizable thickness and shapes available.

TIF200-20-18U thermal pad offers 2.0W/mK conductivity, high-temperature resistance up to 200°C, and UL94 V0 flame rating. Soft, compressible, and naturally tacky for low-stress applications. Custom sizes and die-cut shapes available. RoHS compliant.

High temperature resistant thermal gap pad with 2.6W/mK conductivity and UL94 V-0 rating. Soft, compressible, and electrically insulating for CPU, GPU, and LED applications. Custom shapes and thicknesses available. RoHS compliant.

TIF100-18-56E thermal pad offers 1.8W/mK conductivity, soft compressibility, and UL94 V-0 flame rating. Ideal for CPUs, LEDs, and automotive electronics. Available in custom thicknesses and shapes. RoHS compliant.

TIF100N-25-16S premium soft silicone thermal pad offers 2.5W/mK conductivity, high compliance, and natural tack. Ideal for CPUs, LEDs, and automotive electronics. UL94 V-0 rated, electrically isolating, and available in custom shapes and thicknesses from 0.5mm to 5mm.

High-performance thermal pad with 2.0W/mK conductivity, electrically isolating, soft and compressible for low-stress applications. Naturally tacky, moldable, available in 0.5mm to 5.0mm thickness. UL 94 V0 rated. Ideal for CPUs, power supplies, LEDs, and telecom hardware. Custom sizes and die-cut shapes available.

TIF500 series is a soft, compressible thermal gap pad with 2.6W/mK conductivity. It offers low assembly stress, excellent conformability to rough surfaces, and UL 94 V0 flame rating. Ideal for CPUs, power supplies, and LED applications. Custom thickness and die-cut shapes available.