Thermal Pad

TIF®100-20-50F Pink Thermally Conductive Pad For Unmanned DroneHeat Dissipation​ Product descriptions TlF®100-20-50F use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 2.0W/mK > Moldability for complex parts > Soft and

Ultra Soft TIF®100-20-50E Pink Thermally Conductive Pad For LED/TV Heat Dissipation Product descriptions TlF®100-20-50E is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications

3W Low Cost Silicone Gap Filler Thermal Conductive Pad For Unmanned Aerial Vehicle(UAV) Product descriptions TlF®100-30-05S thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductive > Moldability for complex parts > Soft and compressible for low stress

Ultra Soft TIF®100-12U silicone Thermal Gap Filler Thermal Pad Thermal Sheet For Unmanned Drone Product descriptions TlF®100-12U thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductive > Moldability for complex parts > Soft and compressible for low

Ultra Soft TIF®100-12U silicone Thermal Gap Filler Thermal Pad Thermal Sheet For Unmanned Drone Product descriptions TlF®100-12U thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductive > Moldability for complex parts > Soft and compressible for low

1.5W/MK Thermal Conductivity TIF®100-05E Silicone Thermal Adhesive Pads For GPU Cooling Product descriptions TlF®100-05E thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductive > Moldability for complex parts > Soft and compressible for low stress

TIF®100-05S Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook Product descriptions TlF®100-05S series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductivity > Naturally

Manufature Silicone Thermal Pad Thermal Sheet For Mainboard/Mother Board Product descriptions TlF®100-60-16S series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly

Silicone TIF®200-02E Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink Product descriptions TlF®200-02E series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB

TIF®100-40-12S Thermal Pad Thermal Sheet For Heat Sink Colling Product descriptions TlF®100-40-12S series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the

TIF®400 Yellow 2.0W Thermal Conductivity Silicone Thermal Pads For Telecommunication Hardware Product descriptions TlF®400 series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which

TIF®100-07U Bridging Gaps 1.5W Laptop Silicone Thermal Pads Product descriptions TlF®100-07U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency

Custom-sized thermal interface pad with 1.2W/mK thermal conductivity, available in thicknesses from 0.5mm to 5.0mm. Features Kapton reinforcement, natural tackiness, and UL 94 V0 fire rating. Ideal for CPU, LED systems, and electronic cooling applications with RoHS compliance and fiberglass reinforcement options.

Ziitek TIF100-45-56S silicone thermal pad delivers 4.5W/mK thermal conductivity with 45 Shore 00 hardness. Features natural tackiness, electrical isolation, UL94 V0 fire rating, and custom die-cut options. Ideal for semiconductor test equipment, LED systems, and power applications.

Ultra-soft thermal interface pad with 1.8W/mK conductivity, available in 0.5-5.0mm thickness range. Features natural tackiness, RoHS compliance, UL recognition, and excellent compressibility for low-stress applications. Ideal for CPU cooling, automotive electronics, power supplies, and semiconductor test equipment.

TIF100-16-38UF silicone thermal gap filler pad offers 1.6W/mK thermal conductivity for efficient heat transfer in electronic applications. Features natural tackiness, RoHS compliance, UL recognition, and available in thicknesses from 0.5mm to 5.0mm. Ideal for CPUs, GPUs, motherboards, automotive electronics, and power supply cooling solutions.

TIF100-66U thermal conductive pads feature 1.2W/mK thermal conductivity and thickness range from 0.25mm to 5.0mm. These ceramic-filled silicone elastomer pads provide excellent heat transfer for CPUs, GPUs, and electronic components. RoHS compliant, UL recognized, and available with pressure-sensitive adhesive options for various industrial applications.

High-performance silicone-based thermal interface pads with 1.0W/mK thermal conductivity and UL V-0 flame rating. These gap fillers reduce thermal resistance between heat sources and sinks, featuring RoHS compliance, electrical isolation, and durability for electronics cooling applications including CPUs, motherboards, and portable devices.

TIF100-10-02S thermal interface pad features 1.5 W/m-K thermal conductivity and UL 94 V-0 flame rating. This ceramic-filled silicone elastomer provides excellent heat transfer for LED lighting, power adapters, and electronic devices. Available in thicknesses from 0.5mm to 5.0mm with natural adhesive properties and custom die-cut options.