Thermal Pad

Ultra-soft silicone thermal conductive pad with 2.5W/mK thermal conductivity and 60 Shore 00 hardness. Features natural tackiness, excellent vibration dampening, and electrical isolation. RoHS compliant and UL recognized for semiconductor, CPU, LED, and electronics cooling applications.

Ultra-soft silicone thermal pad with 2.0W/m-K conductivity and 20 Shore 00 hardness for low-stress applications. Features natural tackiness, RoHS compliance, UL recognition, and excellent conformability to irregular surfaces. Available in thicknesses from 0.5mm to 5.0mm with custom die-cut shapes and adhesive options.

TIF100-10-02F silicone thermal pad offers 1.5 W/mK thermal conductivity with thickness range of 0.5-5.0mm. Features UL94 V-0 flame rating, -40°C to 160°C operating temperature, and excellent dielectric properties. Ideal for electronics cooling in IT infrastructure, LED power supplies, and portable devices.

3.0W/M.K Termal Pad Manufacturer Direct Sale Super Soft Thermal Pad With Self-Adhesive Thermal Pad Product descriptions TlF®100-30-01U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-levl softness achieving a perfectly low-strss fit, It is suiabl for addressing issues such as large tolerances, uneven

TIF500-30-11ES Ultra Soft Thermal Pad 3.0W High-Performance Silicone Gap Pads For Electronic Components Product descriptions TIF®500-30-11ES Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines higt thermal conductivity with a near-fluid ultimate softness, ensuring perfect filling of the contact interface even under ultra-low mounting pressure,completely eliminating air

TIF100-20-19S Soft Thermal Pad Electrically Insulating Pad With Exceptional Thermal Conductivity For AI Processors AI Servers Product descriptions The TIF®100-20-19S Series is a well-balanced, general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of

High Insulation Performance Thermally Conductive Gap Filler Pads For Automotive Electronics AI Processors Product descriptions TIF®200-15-27E Seriesis a compound thermal interface material that combines good thermal conductivity, reliable electrical insulation, and soft characteristics.This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength, effectively preventing circuit short circuits. Its soft characteristic allows

TIF100-50-56E UL-94 V0 Flame Rating Conductive Pad For GPU Cooling High Quality Thermal Conductive Pad For AI Processors The TIF®100-50-56E Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness . This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

TIF200-20-18U High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad For Battery Product descriptions TlF®200-20-18U Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 2.0W/mK > Moldability for complex

TIF500®US High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad Product descriptions TIF®500US series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of

TIF100-20-18S Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For Pcb Product descriptions TlFTM100-20-18S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness

High Conductivity Heat Transfer Silicone Thermal Pads For Mainboard/Mother Board Product descriptions TlF®100-18-56E Series is a well-balanced,general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. Features > Good thermal

TIF100N-25-16S Premium Soft 2.5W Blue-Violet Silicone Thermal Pad For Electronic Equipment Product descriptions TIF®100N-25-16S series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity,

TIF100-19U Customized Thermal Conductive Silicone Insulation Pad for Memory Modules Product descriptions TlF100-19U is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductivity 1.5W/mK > Naturally tacky

High Quality High Performance Heat Desipition Insulated Thermal Pad For Electronics Cooling Product descriptions TlF®100-20-19F is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF®100-20-19F is an electrically isolating material, which allows its use in applications requiring isolation between heat

TIF®500 Thermal Pad 2.6W/MK Silicon Thermal Gap Pad Filling For Auditioning Electronic Products Product descriptions TlF®500 series is an extremely soft gap filling material rated at a thermal conductivity of 2.6W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek TIF®500 is highly

Fast Production High Quality Custom Made Thermal Conductive Silicon Pad For Monitoring The Power Box Product descriptions TlF®100-15-27E use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 1.5W/mK > Moldability for complex

Electrically Insulated TIF®100-07E Silicone Thermal Pad Thermally Conductive Silicon Material For Display Card Product descriptions The TIF®100-07E Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic

TIF®400 Yellow 2.0W Thermal Conductivity Silicone Thermal Pads For Telecommunication Hardware Product descriptions TlF®400 series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which

TIF®100-07U Bridging Gaps 1.5W Laptop Silicone Thermal Pads Product descriptions TlF®100-07U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency