Thermal Pad

High-performance 5.0W/mK thermal silicone pad with low oil permeability, high softness, and UL94 V-0 rating. Operates from -45°C to 200°C. Ideal for CPUs, LEDs, and power electronics. Custom thickness and die-cut shapes available.

High-performance silicone thermal pad with 6.0W/mK conductivity. Self-adhesive, soft, and compressible for uneven surfaces. Ideal for CPU/GPU cooling, HPC, and EVs. UL94 V-0, custom thicknesses available.

TS-TIF100C 6530-11 thermal gap filler pad offers 6.5W/mK conductivity, soft elasticity, and self-adhesion for uneven surfaces. Ideal for CPU, GPU, HPC, and EVs. UL94 V0 rated, custom thicknesses and die-cut shapes available.

High-performance silicone-based thermal gap filler with 8.0W/mK conductivity. Self-adhesive, highly compressible, and elastic for uneven surfaces. Available in custom thicknesses and die-cut shapes. UL 94 V0 rated. Ideal for HPC, industrial, and EV applications.

TIF700R thermal pad offers 8.5W/mK conductivity with high tack surface for low contact resistance. Available in 0.5mm to 5.0mm thicknesses, UL 94 V0 rated. Ideal for LED, power, and memory cooling. Custom sizes and die-cut shapes supported.

The TIF500 series is a general-purpose thermal pad offering 2.6W/mK thermal conductivity and self-adhesive properties. It provides excellent surface conformity, high electrical insulation (≥5500V/mm), and UL V-0 flame rating. Ideal for 5G, aerospace, AI, and automotive applications. Custom shapes and thicknesses available.

Ultra-soft thermal pad with 10.0W/mK conductivity, ideal for protecting delicate components. Self-adhesive, good insulation, and V-0 flame rated. Custom shapes and thicknesses available. Certifications: ISO9001, UL.

The TIF100-15-16S series thermal pad offers 1.5 W/mK conductivity, moderate hardness, and self-adhesive design. Ideal for LED lighting, power modules, and home appliances. UL V-0 rated, available in custom shapes and thicknesses from 0.25 to 5.0 mm.

High-performance thermal pad with 8.5W/mK conductivity, low oil permeability, and high softness. Operates from -45°C to 200°C, UL94V0 rated. Ideal for LED, power supply, and battery cooling. Custom thickness and die-cut options available.

High-performance silicone thermal pad with 7.5W/mK conductivity, low hardness, and high tack for optimal heat transfer. UL recognized and RoHS compliant. Custom thickness and die-cut shapes available for B2B applications.

TIF700M silicone thermal pad offers 6.0 W/mK conductivity, high tack surface, and electrical isolation. Ideal for LED, power supplies, and heat pipe solutions. UL 94 V0 rated, custom thicknesses available.

High-performance 8.0W/mK thermal pad with ceramic-filled silicone elastomer for efficient heat transfer. UL94 V-0, RoHS compliant. Electrically isolating, high durability, and customizable thickness from 0.5mm to 5.0mm. Ideal for CPUs, GPUs, LEDs, and automotive electronics.

High-performance thermal pad with 7.0W/mK conductivity, UL94 V-0 rated, RoHS compliant. Fills gaps, insulates, and dampens vibration. Ideal for laptops, LEDs, and automotive electronics. Custom thickness and die-cut shapes available.

High-performance thermal gap pad with 5.0W/mK conductivity, soft and compressible for low-stress applications. UL94 V-0, RoHS compliant. Available in 0.5mm to 5.0mm thickness. Custom die-cut shapes supported for telecom, LED, and power supply use.

Ultra-soft gap filler with 8.0W/mK thermal conductivity and high dielectric breakdown >5500VAC. Low assembly stress, conforms to rough surfaces. UL 94 V0 rated. Custom thicknesses and die-cut shapes available for automotive and electronics cooling.

High-performance thermal pad with 8.0W/mK conductivity, UL 94 V0 rated, and electrically isolating. Fills gaps efficiently for LED, automotive, and telecom applications. Custom thickness and die-cut options available.

TIF500-50-11U is a 5.0W/mK ceramic filled silicone thermal pad with ultra soft 27 Shore 00 hardness for low stress applications. UL94 V-0, RoHS compliant. Naturally tacky, moldable, and available in custom thicknesses and die cut shapes for CPUs, power supplies, and LEDs.

TIF200-01U thermal pad offers 1.5W/mK conductivity, soft compressibility, and natural tack for easy assembly. UL94 V0, RoHS compliant. Custom thicknesses and die-cut shapes available for efficient heat management in electronics.

Soft, compressible silicone gap pad with 3.0 W/mK thermal conductivity and natural tack. UL94 V-0 rated, electrically isolating, and available in custom thicknesses and die-cut shapes for efficient heat dissipation in electronics.

Silicone-based thermal gap pad with 1.8 W/mK conductivity, low hardness, and electrical isolation. Naturally tacky, soft, and compressible for low-stress laptop applications. UL V-0 rated, customizable thickness and shapes.