Thermal Pad

TIF500-18-11U Insulation Gray Silicon Thermal Pad For RDRAM Memory Modules Product descriptions TlF®500-18-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely_sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness,achieving a low stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large

TIF®500-20-11US Gray Silicon Thermal Pad For High Speed Mass Storage Drives Product descriptions TlF®500-20-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely_sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large

Thermally Conductive Sheet Pads Silicon Thermal Pad For Cooling Components To The Chassis Of Frame Product descriptions The TIF®500-20-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision

TIF®500-40-11U Silicone Thermal Pad Gap Filling For Mass storage devices Product descriptions TlF®500-40-11U is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF®500-40-11U is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage

TIF®600GP Garnet 6.0W Thermal Conductivity Silicone Thermal Pads For LED TV And LED-Lit Lamps Product descriptions TlF®600GP series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which

TIF100-10-02S thermal interface pad features 1.5 W/m-K thermal conductivity and UL 94 V-0 flame rating. This ceramic-filled silicone elastomer provides excellent heat transfer for LED lighting, power adapters, and electronic devices. Available in thicknesses from 0.5mm to 5.0mm with natural adhesive properties and custom die-cut options.

Low Volatility Thermal Pad 100x100mm Highly Efficient Thermal Conductivity 4.0W/MK Heat Resistant High Temperature Product descriptions The TIF®100L 4035-06 Series is a soft, low-volatility thermal pad designed specifically for demanding application environments. While providing high thermal conductivity, it significantly reduces the content of volatile silicones. Its high flexibility allows it to fill uneveninterfaces effectively,achieving ultra-low thermal resistance and

High Thermal Conductivity Thermal Gap Filler Designed For Heat Dissipation In Electronic Components And Telecommunication Hardware Product descriptions The TIF®100-50-05S Series is a well-balanced,general-purpose thermal pad.It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide

Silicone Thermal Pad Is A Thermal Management Material Specifically Engineered For AI Processors AI Servers Heat Transfer Products description TIF®100-65-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such

High Performance Ideal Gap Filler 4.0W/MK Thermal Pad For Computer CPU/GPU Cooling Product descriptions TlF®500-40-11U Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.It is an ideal choice

Ultra-soft thermal interface pad with 1.8W/mK conductivity, available in 0.5-5.0mm thickness range. Features natural tackiness, RoHS compliance, UL recognition, and excellent compressibility for low-stress applications. Ideal for CPU cooling, automotive electronics, power supplies, and semiconductor test equipment.

Ziitek TIF100-50-11F thermal pad offers 5.0W/mK conductivity with ultra-soft 60±5 Shore 00 hardness. Features natural tackiness, electrical isolation, UL94 V0 rating, and thickness options from 0.5mm to 5.0mm. Ideal for LED systems, power adapters, routers, and semiconductor test equipment with -40 to 160℃ operating range.