Thermal Pad

TIF100N-25-16S premium soft silicone thermal pad offers 2.5W/mK conductivity, high compliance, and natural tack. Ideal for CPUs, LEDs, and automotive electronics. UL94 V-0 rated, electrically isolating, and available in custom shapes and thicknesses from 0.5mm to 5mm.

High-performance thermal pad with 2.0W/mK conductivity, electrically isolating, soft and compressible for low-stress applications. Naturally tacky, moldable, available in 0.5mm to 5.0mm thickness. UL 94 V0 rated. Ideal for CPUs, power supplies, LEDs, and telecom hardware. Custom sizes and die-cut shapes available.

TIF500 series is a soft, compressible thermal gap pad with 2.6W/mK conductivity. It offers low assembly stress, excellent conformability to rough surfaces, and UL 94 V0 flame rating. Ideal for CPUs, power supplies, and LED applications. Custom thickness and die-cut shapes available.

High-performance thermal interface material with 1.5W/mK conductivity, UL94 V-0 flame rating, and soft compressible design. Custom thicknesses and die-cut shapes available. Ideal for power supplies, CPUs, and automotive electronics.

The TIF100-07E thermal pad offers 1.5 W/m-K thermal conductivity, electrical insulation, and a soft compressible design for low-stress application. Naturally tacky, UL V-0 rated, and available in custom thicknesses and shapes. Ideal for motherboards, power supplies, and automotive electronics.

TIF400 series silicone thermal pads offer 2.0W/m-K conductivity, soft compressibility, and natural tack for easy installation. Ideal for telecom hardware, LED lighting, and power adapters. UL V-0 rated, customizable thickness, and electrically isolating.

TIF100-07U thermally conductive silicone pad fills air gaps between heat sources and heatsinks. With 1.5W/m-K conductivity, soft compressibility, and natural tack, it enhances thermal efficiency. UL V-0 rated, customizable thickness, ideal for LEDs, power adapters, and automotive electronics.

TIF100-12-66U silicone thermal pads provide excellent 1.5W/m-K thermal conductivity for efficient heat dissipation in electronic applications. Features include natural adhesion, RoHS compliance, UL 94 V-0 flame rating, and availability in standard 8x16 inch sheets with custom die-cut options. Ideal for LED lighting, power adapters, and cooling systems.

Ziitek TIF100-45-56S silicone thermal pad delivers 4.5W/mK thermal conductivity with 45 Shore 00 hardness. Features natural tackiness, electrical isolation, UL94 V0 fire rating, and custom die-cut options. Ideal for semiconductor test equipment, LED systems, and power applications.

TIF100-66U thermal conductive pads feature 1.2W/mK thermal conductivity and thickness range from 0.25mm to 5.0mm. These ceramic-filled silicone elastomer pads provide excellent heat transfer for CPUs, GPUs, and electronic components. RoHS compliant, UL recognized, and available with pressure-sensitive adhesive options for various industrial applications.

Ultra-soft thermal pad with 2.8W/mK conductivity, ideal for protecting sensitive AI server components. Self-adhesive, excellent insulation, and conforms to uneven surfaces. UL V-0 rated, custom sizes available.

TIF200-04ES thermal pad offers 1.0 W/mK conductivity, extreme softness, and reliable insulation. Self-adhesive, puncture-resistant, and UL 94 V-0 rated. Ideal for power devices, EVs, and electronics. Custom shapes and thicknesses available.

Ultra-soft thermal gap filler with 1.5W thermal conductivity and 65 Shore 00 hardness. Protects delicate components from mechanical stress. Self-adhesive, V-0 rated, customizable thickness from 0.25mm to 5mm. Ideal for 5G, aerospace, and AI applications.

Ultra-soft thermal pad with 5.0W/mK conductivity, designed for stress-sensitive components. Self-adhesive, good insulation, and available in custom thicknesses. Ideal for AI processors, EV batteries, and LED cooling.

High thermal conductivity 5.0W/mK, super soft silicone pad with self-adhesive and UL94 V-0 rating. Ideal for AI processors, CPUs, and power electronics. Custom shapes and thicknesses available. RoHS compliant.

Ultra-soft thermal pad with 5.0 W/m-K conductivity, ideal for stress-sensitive components. Self-adhesive, RoHS & UL compliant. Custom thicknesses from 0.25mm to 5.0mm available. Suitable for automotive, LED, and telecom applications.

Ultra soft thermal pad with 5.0W/mK conductivity, ideal for AI servers, inverters, and telecom devices. Self-adhesive, V-0 flame rated, and customizable in thickness and shape for low-stress assembly.

Ziitek TIF100-20-11PSA is a soft, compressible silicone thermal pad with 2.0W/mK conductivity. Naturally tacky, electrically isolating, and UL 94-V0 rated. Ideal for CPUs, LEDs, and automotive electronics. Custom thicknesses and die-cut shapes available.

Ziitek TIF100-20-50U is a soft, compressible thermal gap filler with 2.0W/mK conductivity and electrical isolation. Naturally tacky, it offers low-stress vibration dampening and high durability. Ideal for CPUs, GPUs, and power supplies. UL V0 rated, thickness 0.5–5.0mm, custom die-cut available.

High-performance thermal gap filler with 6.5 W/mK conductivity, naturally tacky surface, and excellent flexibility. Ideal for uneven surfaces in telecom, automotive, and LED applications. UL94 V-0 rated, available in custom thicknesses from 0.5mm to 5.0mm.