Ultra Soft 1.0mmT Thermal Gap Filler For Telecommunication 3.0 W/MK 20 Shore 00

1.0mmT professional factory thermal gap filler For telecommunication hardware 3.0 W/mK ultra soft,20 Shore 00
 
 
  The TIF540-30-11US Series is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling TIF540-30-11US maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. TIF540-30-11US features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made configurations available upon request

TIF500-30-11US Datasheet-REV02.pdf
 
Features:
> Good thermal conductive: 3.0 W/mK 

>Thickness:1.0mmT

>Naturally tacky needing no further adhesive coating

>Broad range of hardnesses available

>UL recognized

>RoHS compliant

Applications:

>Telecommunication hardware

>Handheld portable electronics

>Memory Modules

>Mass storage devices

>GPS navigation and other portable devices

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL