Thermal Conductive Gap Pad For GPS Navigation And Portable Devices 1.2w/MK
1.2w/MK professional factory thermal conductive gap pad for GPS navigation and other portable devices
The TIF180-12-05ES is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
TIF100-12-05ES-Series-Datasheet.pdf
Features:
> Good thermal conductive: 1.2 W/mK
>Thickness:2.0mmT
>hardnesses :12±5 (Shore 00)
>RoHS compliant
>UL recognized
Applications:
>GPS navigation and other portable devices
>CD-Rom, DVD-Rom cooling
>LED Power Supply
>Micro heat pipe thermal solutions
>Automotive engine control units
Typical Properties of TIF180-12-05ES Series | ||||
Color | blue | Visual | Composite Thickness | hermalImpedance @10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.55 |
| 20mils / 0.508 mm | 0.82 | |||
desity | 2.0 g/cm3 | ASTM D297 | 30mils / 0.762 mm | 1.01 |
40mils / 1.016 mm | 1.11 | |||
| Thickness | 2.0mmT | *** | 50mils / 1.270 mm | 1.27 |
60mils / 1.524 mm | 1.45 | |||
Hardness | 12±5 (Shore 00) | ASTM 2240 | 70mils / 1.778 mm | 1.61 |
80mils / 2.032 mm | 1.77 | |||
| Tensile Strength | 40 psi | ASTM D412 | 90mils / 2.286 mm | 1.91 |
100mils / 2.540 mm | 2.05 | |||
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 2.16 |
120mils / 3.048 mm | 2.29 | |||
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 2.44 |
140mils / 3.556 mm | 2.56 | |||
Dielectric Constant | 4.5MHz | ASTM D150 | 150mils / 3.810 mm | 2.67 |
160mils / 4.064 mm | 2.77 | |||
Volume Resistivity | 1.0X1012 Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 2.89 |
180mils / 4.572 mm | 2.98 | |||
Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 3.05 |
200mils / 5.080 mm | 3.14 | |||
Thermal conductivity | 1.2 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Advantage
Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.