Ultra Soft Thermal Gap Filler 12±5 Shore 00 with 1.5 W/mK Conductivity for GPS and Portable Devices
Price:
negotiation
MOQ:
1000pcs
Delivery Time:
3-5 work days
Brand:
ZIITEK
Product Description
Product Overview
The TIF1120-05ES ultra soft thermal gap filler is engineered for efficient heat transfer in compact electronic devices. This ceramic-filled silicone rubber material fills gaps between heating and cooling components while providing insulation, damping, and sealing functions to support miniaturized and ultra-thin equipment designs.
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 1.5 W/mK | ASTM D5470 |
| Thickness | 3.0mm | - |
| Hardness | 12±5 Shore 00 | ASTM 2240 |
| Density | 2.0 g/cm³ | ASTM D297 |
| Continuous Use Temperature | -40 to 160℃ | - |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Fire Rating | 94 V0 (UL equivalent) | - |
Key Features
- Excellent thermal conductivity of 1.5 W/mK
- Ultra soft 12±5 Shore 00 hardness for optimal conformability
- Moldable for complex component shapes
- Superior thermal performance across temperature ranges
- UL 94 V0 fire rating for safety compliance
Applications
- GPS navigation systems and portable devices
- Automotive electronics and LED ceiling lamps
- CPU cooling and display card thermal management
- Motherboard thermal interfaces and power adapters
- Mass storage devices and monitoring power boxes
Technical Documentation
Manufacturer Information
Ziitek Company brings over 13 years of thermal interface material expertise with proprietary formulations and core technologies. Our 5,000-10,000 square meter facility in Guangdong Province, China delivers quality competitive products for global customers seeking long-term partnerships.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronic Materials & Technology Ltd.
Location
No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai