3.0 W/M-K Silicone Thermal Pad For Audio And Video Components 20±5 Shore 00 3.0 G/Cc
3.0 W/M-K low cost silicone thermal pad For Audio and video components, 20±5 Shore 00, 3.0 g/cc
The TIF160-30-11US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100-30-11US-Series-Datasheet-.pdf
Features
> Good thermal conductive: 3.0 W/mK
>Thickness:1.5mmT
>hardness:20±5 shore00
>Colour: gray
>Fiberglass reinforced for puncture, shear and tear resistance
>Easy release construction
Applications
>Audio and video components
>Mass storage devices
>Automotive electronics
>Set top boxes
>Micro heat pipe thermal solutions
>Automotive engine control units
>Telecommunication hardware
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Typical Properties of TIF160-30-11US Series
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Color
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gray
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Visual
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Composite Thickness
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Thermal Impedance@10psi
(℃-in²/W) |
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Construction &
Compostion |
Ceramic filled silicone rubber
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***
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10mils / 0.254 mm
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0.16
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20mils / 0.508 mm
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0.20
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Specific gravity |
3.0g/cc
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ASTM D297
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30mils / 0.762 mm
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0.31
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40mils / 1.016 mm
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0.36
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| Thickness |
1.5mmT
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***
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50mils / 1.270 mm
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0.42
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60mils / 1.524 mm
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0.48
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Hardness
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20±5 Shore 00
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ASTM 2240
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70mils / 1.778 mm
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0.53
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80mils / 2.032 mm
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0.63
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Outgassing(TML)
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0.35%
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ASTM E595
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90mils / 2.286 mm
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0.73
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100mils / 2.540 mm
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0.81
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Continuos Use Temp
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-40 to 160℃
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***
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110mils / 2.794 mm
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0.86
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120mils / 3.048 mm
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0.93
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Dielectric Breakdown Voltage
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>5500 VAC
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ASTM D149
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130mils / 3.302mm
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1.00
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140mils /3.556 mm
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1.08
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Dielectric Constant
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4.0 MHz
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ASTM D150
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150mils / 3.810 mm
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1.13
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160mils / 4.064 mm
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1.20
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Volume Resistivity
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1.0X1012
Ohm-cm |
ASTM D257
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170mils / 4.318 mm
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1.24
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180mils / 4.572 mm
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1.32
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Fire rating
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94 V0
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equivalent
UL |
190mils / 4.826 mm
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1.41
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200mils / 5.080 mm
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1.52
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Thermal conductivity
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3.0 W/m-K
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ASTM D5470
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Visua l/ ASTM D751
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ASTM D5470
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Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
FACTORY INFORMATION:
Factory Size
5,000-10,000 square meters
Factory Country/Region
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, P.R.China
Annual Output Value
US$1 Million - US$2.5 Million
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.