Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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1.0x10^12 Ohm-Cm Heat Sink Thermal Gap Pad 3.5mm Thickness

Price Negotiable
Price: negotiation
MOQ: 1000pcs
Delivery Time: 3-5 work days
Brand: ZIITEK
Product Description

1.0X10^12 Ohm-cm Moldability for Complex Parts Heat Sink Pad for Handheld Portable Electronics

 

     The TIF1140-05UF thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.

 

 

Features

> Good thermal conductive: 1.5 W/mK 

>Thickness: 3.5mmT

>hardness:75 shore 00

>Colour: Blue

>Moldability for complex parts
>Soft and compressible for low stress applications
>Naturally tacky needing no further adhesive coating

 

 

 

 

 

Applications

>Automotive engine control units

>Telecommunication hardware

>Handheld portable electronics

>Semiconductor automated test equipment (ATE)

>CPU

>display card

 

Typical Properties of TIF1140-05UF Series
Color
Blue
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

 2.2 g/cc 

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
3.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

 75 Shore 00

ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgasing (TML)
0.35%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

 3.9 MHz

ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
1.5 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

 

 

 

 

 

 

 

 

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

 

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

 

TIF™ series Individual die cut shapes can be supplied.

 

 

FAQ:

Q:Is there promotion price for big buyer?
A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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