1.0x10^12 Ohm-Cm Thermal Gap Pad 3.5mm Thickness 1.5 W/mK Silicone Heat Sink
1.0X10^12 Ohm-cm Moldability for Complex Parts Heat Sink Pad for Handheld Portable Electronics
The TIF1140-05UF thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.
Features
> Good thermal conductive: 1.5 W/mK
>Thickness: 3.5mmT
>hardness:75 shore 00
>Colour: Blue
>Moldability for complex parts
>Soft and compressible for low stress applications
>Naturally tacky needing no further adhesive coating
Applications
>Automotive engine control units
>Telecommunication hardware
>Handheld portable electronics
>Semiconductor automated test equipment (ATE)
>CPU
>display card
|
Typical Properties of TIF1140-05UF Series
|
||||
|
Color
|
Blue |
Visual
|
Composite Thickness
|
Thermal Impedance@10psi
(℃-in²/W) |
|
Construction &
Compostion |
Ceramic filled silicone elastomer
|
***
|
10mils / 0.254 mm
|
0.16
|
|
20mils / 0.508 mm
|
0.20
|
|||
|
Specific gravity |
2.2 g/cc |
ASTM D297
|
30mils / 0.762 mm
|
0.31
|
|
40mils / 1.016 mm
|
0.36
|
|||
| Thickness |
3.5mmT
|
***
|
50mils / 1.270 mm
|
0.42
|
|
60mils / 1.524 mm
|
0.48
|
|||
|
Hardness
|
75 Shore 00 |
ASTM 2240
|
70mils / 1.778 mm
|
0.53
|
|
80mils / 2.032 mm
|
0.63
|
|||
| Outgasing (TML) |
0.35%
|
ASTM E595
|
90mils / 2.286 mm
|
0.73
|
|
100mils / 2.540 mm
|
0.81
|
|||
|
Continuos Use Temp
|
-40 to 160℃
|
***
|
110mils / 2.794 mm
|
0.86
|
|
120mils / 3.048 mm
|
0.93
|
|||
|
Dielectric Breakdown Voltage
|
>5500 VAC
|
ASTM D149
|
130mils / 3.302mm
|
1.00
|
|
140mils /3.556 mm
|
1.08
|
|||
|
Dielectric Constant
|
3.9 MHz |
ASTM D150
|
150mils / 3.810 mm
|
1.13
|
|
160mils / 4.064 mm
|
1.20
|
|||
|
Volume Resistivity
|
1.0X1012
Ohm-cm |
ASTM D257
|
170mils / 4.318 mm
|
1.24
|
|
180mils / 4.572 mm
|
1.32
|
|||
|
Fire rating
|
94 V0
|
equivalent
UL |
190mils / 4.826 mm
|
1.41
|
|
200mils / 5.080 mm
|
1.52
|
|||
|
Thermal conductivity
|
1.5 W/m-K
|
ASTM D5470
|
Visua l/ ASTM D751
|
ASTM D5470
|
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
FAQ:
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.