TIS™ 680-28AB Series is a two-component, high thermal conductive silicone encapsulant designed for LED panel light potting applications. With 2.8W/m-K thermal conductivity and UL 94 V-0 fire resistance rating, this material effectively dissipates heat from electronic components to metal housings or heat sinks, enhancing efficiency and extending component lifespan.

• 2.8W/m-K thermal conductivity for efficient heat dissipation
• Excellent electrical insulation and smooth surface finish
• Low shrinkage during curing process
• Low viscosity for easy air release and application
• Superior solvent resistance and waterproof properties
• Extended operational lifetime for electronic components
• Excellent thermal shock efficiency and impact resistance

• LED lighting heat spreaders and power driver potting
• Ferrite cements and tip-type LED applications
• Relay sealants with strong adhesion to rubber, ceramics, PCB, and plastics
• Power transformers, coils, and capacitor potting
• Small electrical device encapsulation
• LCD substrate adhesion and coating applications
• IGBT modules and transformer fire retardant solutions
• Optical and medical component bonding

• 1KG A/B per tank
• 5KG A/B sets
• 10KG A/B sets