Dongguan Ziitek Electronical Material and Technology Co., Ltd
                                                                                                           
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Chemicals Adhesives & Sealants

1.5W/mK Two Component Thermal Conductive Adhesive for LED Panel Light Potting - 4000 mPa.s Viscosity, UL94 V-0 Rated

Price Negotiable
Price: Negotiable
MOQ: 1KG/PC
Delivery Time: 2-3 work day
Brand: Ziitek
Product Description
Product Overview

TIS™680-15AB is a two-component thermal conductive adhesive specifically designed for LED panel light potting applications. This high-performance encapsulant features excellent thermal conductivity of 1.5W/mK and provides reliable protection for capacitors and electrical devices.

TIS680-15AB thermal conductive adhesive product display
Key Features
  • High thermal conductivity: 1.5W/mK
  • Excellent electrical insulation properties
  • Low viscosity for easy application and air release
  • Minimal shrinkage during curing
  • Superior solvent resistance and waterproof performance
  • Enhanced thermal shock efficiency and impact resistance
  • Extended product lifespan
  • UL94 V-0 fire resistance rating
Applications
  • LED lighting heat spreader and power driver potting
  • Ferrite cements and tip-type LED applications
  • Relay sealants with excellent adhesion to rubber, ceramics, PCB, and plastics
  • Power transformers, coils, and capacitor potting
  • Small electrical device encapsulation
  • LCD and substrate adhesion
  • Coating and sealant applications for optical/medical components
Technical Specifications
Uncured Material Properties
Parameter TIS TM680-15A (Resin) TIS TM680-15B (Hardener)
Color White White
Viscosity @25℃ 4000 mPa.s 4000 cPs
Specific Gravity 1.5g/cc³ 1.5g/cc³
Shelf Life @25℃ 12 months 12 months
Mixing and Curing
Parameter Value
Mixing Ratio (By Weight) A:B = 100:100
Viscosity @25℃ 4000 mPa.s
Working Pot Life (250g @25℃) 30 minutes
Cure at 25℃ 3 hours
Cure at 70℃ 20 minutes
Cured Material Properties
Parameter Value
Hardness (Shore A) @25℃ 85 Shore D
Operating Temperature -40℃ to 160℃
Glass Transition Temperature (Tg) 92℃
Elongation 4.50%
Coefficient of Thermal Expansion 3.0×10⁻⁵/℃
Thermal Conductivity 1.5W/m·K
Thermal Impedance @10psi 0.36℃·in²/W
Dielectric Strength 400 volts/mil
Volume Resistivity @25℃ 3.0×10¹³ ohm·cm
Moisture Absorption (24h water immersion) <0.1%

Packaging Options
  • 1KG A/B per tank
  • 5KG A/B each
  • 10KG A/B each
TIS680-15AB thermal adhesive packaging options

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Co., Ltd
Location No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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