Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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Chemicals Adhesives & Sealants

1.5W/mK Two Component Thermal Conductive Adhesive for LED Panel Light Potting - 4000 mPa.s Viscosity, UL94 V-0 Rated

Price Negotiable
Price: Negotiable
MOQ: 1KG/PC
Delivery Time: 2-3 work day
Brand: Ziitek
Product Description
Product Overview

TIS™680-15AB is a two-component thermal conductive adhesive specifically designed for LED panel light potting applications. This high-performance encapsulant features excellent thermal conductivity of 1.5W/mK and provides reliable protection for capacitors and electrical devices.

TIS680-15AB thermal conductive adhesive product display
Key Features
  • High thermal conductivity: 1.5W/mK
  • Excellent electrical insulation properties
  • Low viscosity for easy application and air release
  • Minimal shrinkage during curing
  • Superior solvent resistance and waterproof performance
  • Enhanced thermal shock efficiency and impact resistance
  • Extended product lifespan
  • UL94 V-0 fire resistance rating
Applications
  • LED lighting heat spreader and power driver potting
  • Ferrite cements and tip-type LED applications
  • Relay sealants with excellent adhesion to rubber, ceramics, PCB, and plastics
  • Power transformers, coils, and capacitor potting
  • Small electrical device encapsulation
  • LCD and substrate adhesion
  • Coating and sealant applications for optical/medical components
Technical Specifications
Uncured Material Properties
Parameter TIS TM680-15A (Resin) TIS TM680-15B (Hardener)
Color White White
Viscosity @25℃ 4000 mPa.s 4000 cPs
Specific Gravity 1.5g/cc³ 1.5g/cc³
Shelf Life @25℃ 12 months 12 months
Mixing and Curing
Parameter Value
Mixing Ratio (By Weight) A:B = 100:100
Viscosity @25℃ 4000 mPa.s
Working Pot Life (250g @25℃) 30 minutes
Cure at 25℃ 3 hours
Cure at 70℃ 20 minutes
Cured Material Properties
Parameter Value
Hardness (Shore A) @25℃ 85 Shore D
Operating Temperature -40℃ to 160℃
Glass Transition Temperature (Tg) 92℃
Elongation 4.50%
Coefficient of Thermal Expansion 3.0×10⁻⁵/℃
Thermal Conductivity 1.5W/m·K
Thermal Impedance @10psi 0.36℃·in²/W
Dielectric Strength 400 volts/mil
Volume Resistivity @25℃ 3.0×10¹³ ohm·cm
Moisture Absorption (24h water immersion) <0.1%

Packaging Options
  • 1KG A/B per tank
  • 5KG A/B each
  • 10KG A/B each
TIS680-15AB thermal adhesive packaging options

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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