TIF015AB-07S Thermal Putty 1.5W/mK Silicone Gel for Motherboard Cooling Applications
TIF015AB-07S Series is a highly thermal conductive, two-component liquid gap filling material with 1.5 W/mK thermal conductivity. This silicone thermal gel provides excellent heat transmission from electronic components to heat sinks or metal housings, enhancing efficiency and extending component lifespan.
- Excellent thermal conductivity: 1.5 W/mK
- Two-part formulation for easy storage and handling
- Superior mechanical and chemical stability across temperature ranges (-45°C to 200°C)
- Ultra-conforming low-stress interface application
- Ambient or accelerated cure schedules available
- Optimized shear thinning characteristics for easy dispensing
- Computer systems and peripherals
- Telecommunications equipment
- Automotive electronics
- Thermally conductive vibration dampening
- Heat sinks and heat-generating semiconductors
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 1.5 W/mK | ISO 22007-2 |
| Continuous Use Temperature | -45°C to 200°C | Standard Test |
| Hardness | 45 Shore 00 | ASTM D2240 |
| Volume Resistivity | 10¹² Ohm-meter | ASTM D257 |
| Flame Rating | 94V0 | E331100 |
| Mix Ratio | 1:1 | Standard |
| Pot Life @25°C | 30 minutes | Standard Test |
| Cure Time @25°C | 60 minutes | Standard Test |
| Viscosity as Mixed | 400,000 cps | GB/T 10247 |
Standard packaging: 50cc per piece, 400 pieces per box, 9 pieces per box. Custom syringe packaging available for automated dispensing applications.
Ziitek Electronic Material and Technology Ltd. specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. With extensive experience in thermal engineering, we provide customized products, full product lines, and flexible production capabilities.
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