High-performance silicone thermal gap filler with 5.0W/mK thermal conductivity, designed for superior heat dissipation in demanding electronic applications.

TIF050-11 is a soft silicone putty thermal gap filler formulated with exclusive technology to deliver exceptional thermal performance and compressibility. Manufactured using high-viscosity silicone oil, this material prevents thermal compound separation and offers superior bonding stability compared to traditional thermal pads.

Operates similarly to thermal grease with versatile application options including screen printing, silk screening, and automated injection facilities. Ideal for use on chip microprocessors, PPGAs, Micro BGA packages, BGA packages, DSP chips, LED lighting systems, and other high-power electronic components.

• Heat-sink and frame assemblies
• LED backlight modules and LED lighting systems
• High-speed hardware drivers
• Micro heat pipes and vehicle engine controllers
• Telecommunications industry equipment
• Semiconductor manufacturing

• High thermal conductivity: 5.0W/mK
• Soft texture with very low compression force
• Low thermal impedance for efficient heat transfer
• Compatible with automated application systems

Standard packaging: 30 cc per piece (98 pieces per box) or 300 cc per piece (6 pieces per box). Custom syringe packaging available for automated dispensing applications. Contact us for specific packaging requirements.