Thermal Gap Filler 1.6 W/mK Silicone Pad 0.25-5.0mm for Heat Dissipation
Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance
The TIF®100-16-38UF is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
Features:
> Good thermal conductive: 1.6 W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> RoHS compliant
> UL recognized
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
| Typical Properties of TIF®100-16-38UF Series | |||
| Property | Value | Test method | |
| Color | Deep red | Visual | |
| Construction | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 2.1 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| 0.25~0.50 | 0.75~5.00 | ||
| Hardness(Shore 00) | 75 | 75 | ASTM 2240 |
| Recommend Operating Temperature(℃) | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥ 5500 | ASTM D149 | |
| Dielectric Constant @1Mhz | 5.5 | ASTM D150 | |
| Volume Resistivity (Ohm-meter) | ≥1.0X1012 | ASTM D257 | |
| Thermal Conductivity (W/m-K) | 1.6 | ASTM D5470 | |
| 1.6 | ISO22007 | ||
| Fire rating | V-0 | UL 94 (E331100) | |
Standard Thickness: 0.010" (0.25 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.