1.5 W/mK Silicone-Free Thermal Gap Filler Pad 0.25-5.0mm Thickness for LED and Electronics Cooling

Z-Paster100-30-10UF Series is a high-performance, silicone-free thermal conductive interface material designed to fill air gaps between heating elements and heat dissipation components. With a thermal conductivity of 1.5 W/mK, this thermal gap filler effectively transfers heat to metal housings or dissipation plates, enhancing the efficiency and lifespan of heat-generating electronic components.

• Silicone-free formulation for sensitive applications
• ROSH compliance for environmental safety
• 1.5 W/mK thermal conductivity for efficient heat transfer
• Soft and compressible design for low stress applications
• Available in various thicknesses from 0.25mm to 5.0mm
• Excellent dielectric properties for electrical insulation

• LED Lighting systems
• Car Battery & Power Supply units
• Charging Pile thermal management
• Graphics Card Thermal Modules
• Medical devices requiring silicone-free materials
• SFP optical modules and miniature heat tube radiators
• Set Top Box cooling solutions

Packaging: Protected with PET film or foam, paper card separation between layers, export carton packaging. Custom packaging available upon request.

Lead Time: 3-7 work days for in-stock items, 7-10 work days for custom orders. Sample quantities available free of charge.