Thermal Conductive Silicone Pad 1.5 W/mK for CPU Heat Dissipation 0.5mm to 5mm Thickness
The TIF®100-10-01U Series thermally conductive interface materials are applied to fill the air gaps between heating elements and heat dissipation fins or metal bases. Their flexibility and elasticity make them ideal for coating uneven surfaces. Heat can transmit to metal housing or dissipation plates from separate elements or entire PCBs, effectively enhancing the efficiency and lifespan of heat-generating electronic components.
- Good thermal conductivity: 1.5 W/mK
- Naturally tacky - no additional adhesive coating required
- Soft and compressible for low stress applications
- Available in various thicknesses
- Easy release construction
- Electrically isolating
- High durability
- Cooling components to chassis or frame
- High speed mass storage drives
- Heat sinking housing at LED-lit BLU in LCD
- LED TV and LED-lit lamps
- RDRAM memory modules
- CPU
- Display card
- Mainboard/motherboard
| Property | Value | Test Method |
|---|---|---|
| Color | Black | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | ****** |
| Density (g/cm³) | 2.0 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.020 | 0.030~0.200 0.25~0.50 | 0.75~5.0 |
ASTM D374 |
| Hardness (Shroe 00) | 65 | 27 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** |
| Breakdown Voltage (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @ 1MH | 4.5 | ASTM D150 |
| Volume Resistivity | ＞1.0*10¹² Ohm-meter | ASTM D257 |
| Flame Rating | V-0 | UL 94 (E331100) |
| Thermal Conductivity | 1.0 W/m-K 1.0 W/m-K |
ASTM D5470 ISO22007 |
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"*16" (406 mm*406 mm)
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Ziitek Electronic Material and Technology Ltd. is an R&D and production company with multiple production lines and processing technologies for thermal conductive materials. We own advanced production equipment and optimized processes, providing various thermal solutions for different applications.
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