TIS580-20 2.0W/mK Dealcoholized Thermally Conductive Silicone Adhesive with 45 Shore A Hardness
TIS™580-20 Series is a one-component, dealcoholized, room temperature cure thermally conductive silicone adhesive designed for electronic component applications. This advanced formulation provides excellent heat conduction and strong adhesion properties, curing into a high-hardness elastomer that firmly attaches to substrates while minimizing thermal impedance.
- High thermal conductivity: 2.0W/mK
- Excellent electrical insulation properties
- Low shrinkage during curing process
- Low viscosity for void-free surface application
- Good solvent and water resistance
- Extended working life and excellent thermal shock resistance
- Strong adhesion to copper, aluminum, stainless steel, and other metals
- Non-corrosive dealcoholized formulation
Ideal for replacing traditional thermal pastes and pads in gap-filling applications between LED aluminum motherboards and heat sinks, high-power electrical modules and heat sinks. Suitable for use in portable computers, microprocessors, high-power LEDs, internal storage modules, DC/AC translators, IGBT power modules, semiconductor encapsulation, relay switches, rectifiers, and transformers.
| Property | Value | Test Method |
|---|---|---|
| Appearance | White paste | Visual |
| Density (g/cm³, 25℃) | 1.6 | ASTM D297 |
| Tack-free time (min, 25℃) | ≤20 | Internal Method |
| Viscosity @25℃ Brookfield (Uncured) | 20K cps | ASTM D1084 |
| Total cure time (days, 25℃) | 3-7 | Internal Method |
| Hardness (Shore A) | 45 | ASTM D2240 |
| Lap Shear Strength (MPa) | ≥2.5 | ASTM D1876 |
| Operation temperature (℃) | -60～250 | Internal Method |
| Thermal Conductivity W/(m*K) | 2.0 | ASTM D5470 |
| Flame Retardancy | UL94 V-0 | E331100 |
Ziitek Electronic Material and Technology Ltd. specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. With extensive experience in thermal engineering, we provide customized products, comprehensive product lines, and flexible production capabilities to meet diverse customer requirements.
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