Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules
Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules
TIF®100C 10075-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.
Features:
> Excellent thermal conductivity 10.0W/mK
> Self-adhesive without the need foradditional surface adhesive
> Highly compressible, soft, and elasticAvailable in various thicknesses
> Good chemical stability
Applications:
> Cooling components to the chassis of frame
> CPU and GPU processors and other chipsets
> High-performance computing (HPC)
> Industrial equipment
> Network communication devices
> New energy vehicles
| Typical Properties of TIF®100C 10075-11 Series | ||
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Specific Gravity | 3.3g/cc | ASTM D297 |
| thickness | 0.020"(0.50mm)~0.200"(5.00mm) | ASTM D374 |
| Hardness (thickness＜1.0mm) | 75 (Shore 00) | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ****** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 5.5MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 10.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Product Thicknesses: 0.020"(0.50mm)-0.200"(5.00mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.