8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard
8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard
TIFTM760R thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Excellent thermal conductivity 8.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
Applications:
> Cooling components to the chassis of frame
> Set Top Box
> Car Battery & Power Supply
> Charging Pile
> LED TV/ Lighting
> Graphics Card Thermal Module
| Typical Properties of TIF760R Series | ||
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Specific Gravity | 3.55g/cm3 | ASTM D297 |
| Thickness | 1.5mmT | ASTM D374 |
| Hardness | 30±10 Shore 00 | ASTM 2240 |
| Operating Temp | -45 to 200℃ | ****** |
| Dielectric Breakdown Voltage | >4000 VAC | ASTM D149 |
| Dielectric Constant | 5.5MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94-V0 | equivalent UL |
| Thermal conductivity | 5.5W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Product Thicknesses:
Product Thicknesses:0.020-inch to 0.200-inch(0.5mm to 5.0mm)
Product Sizes:8" x 16"(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied. Please contact us for confirming.
Safe disposal method does not require special protection. The storage condition is low temperature and dry , away from openfire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
Independent R&D team
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