Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Laptop Desktop GPU Computer
Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Laptop Desktop GPU Computer
Product description
TIF100-10-02F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Excellent thermal conductivity: 1.0W/mK
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Easy release construction
> Electrically isolating
> High durability
Applications
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
| Typical Properties of TIF100-10-02F Series | ||
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer | ***** |
| Specific Gravity | 2.3 g/cc | ASTM D297 |
| Hardness | 60 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 160℃ | ***** |
| Dielectric Breakdown Voltage(T-1.0mm) | >5500 VAC | ASTM D149 |
| Dielectric Constant @ 1MHz | 4.0 | ASTM D150 |
| Volume Resistivity | 1.0x1012 Ohm-meter | ASTM D257 |
| Flame rating | 94 V0 | UL E331100 |
| Thermal conductivity | 1.0 W/m-K | ASTM D5470 |
| Outgassing(TML) | 0.35% | ASTM E595 |
Product Specification
Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied.Please contact us for confirming.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.