Thermal Silicone Pad Gap Filler 1.5W/mK for CPU LED Cooling Insulation 0.5mm-5mm
The TIF® 100-05S Series thermally conductive interface materials are designed to fill air gaps between heating elements and heat dissipation fins or metal bases. Their flexibility and elasticity make them ideal for coating uneven surfaces, effectively transferring heat to metal housings or dissipation plates from heating elements or entire PCBs, thereby enhancing the efficiency and lifespan of heat-generating electronic components.
- Good thermal conductivity: 1.5 W/mK
- Moldability for complex parts
- Soft and compressible for low stress applications
- High tack surface reduces contact resistance
- RoHS compliant
- UL recognized
- Cooling components to the chassis or frame
- High speed mass storage drives
- Heat sinking housing at LED-lit BLU in LCD
- LED TV and LED-lit lamps
- RDRAM memory modules
- Micro heat pipe thermal solutions
- Automotive engine control units
- Telecommunication hardware
- Handheld portable electronics
- Semiconductor automated test equipment (ATE)
- CPU
- Display card
- Mainboard/motherboard
- Notebook
- Power supply
| Property | Value | Test Method |
|---|---|---|
| Color | Blue | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | *** |
| Density (g/cm³) | 2.0 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.020 / 0.25~0.50 0.030~0.200 / 0.75~5.00 |
ASTM D374 |
| Hardness | 65 Shore 00 45 Shore 00 |
ASTM 2240 |
| Continuous Use Temp | -40 to 200℃ | *** |
| Breakdown Voltage (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity | ＞1.0×10¹² Ohm-meter | ASTM D257 |
| Thermal Conductivity (W/m-K) | 1.5 | ASTM D5470 ISO22007 |
| Fire Rating | V-0 | UL 94 (E331100) |
Standard Thickness: 0.010" (0.25 mm) – 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm × 406 mm)
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
The packaging of thermal pad includes:
- PET film or foam for protection
- Paper card to separate each layer
- Export carton inside and outside
- Customized packaging to meet customer requirements
Lead Time: Quantity: 5000 pieces, Estimated Time: To be negotiated
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006 and is a high-tech enterprise specializing in the research, development, production, and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad, heat-conducting grease, heat-conducting plastic, silicone rubber, and silicone rubber foam.
We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism, and innovation.
ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Our dedicated research and development team ensures continuous innovation and product improvement.
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