Thermal Silicone Gap Pad 1.5W/mK for Semiconductor Medical Equipment Cooling
The TIF®100-06S Series is a silicone-based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, is conformable, and is electrically isolating. The low modulus characteristic offers optimal thermal performance with ease of handling.
- Good thermal conductivity: 1.5W/mK
- Moldability for complex parts
- Soft and compressible for low stress applications
- Outstanding thermal performance
- High tack surface reduces contact resistance
- RoHS compliant
- UL recognized
- Cooling components to the chassis of frame
- High speed mass storage drives
- Heat Sinking Housing at LED-lit BLU in LCD
- LED TV and LED-lit lamps
- RDRAM memory modules
- Micro heat pipe thermal solutions
- Automotive engine control units
- Telecommunication hardware
- Handheld portable electronics
- Semiconductor automated test equipment (ATE)
- CPU
- Display card
- Mainboard/mother board
- Heat pipe thermal solutions
- Memory Modules
- Mass storage devices
| Property | Value | Test Method |
|---|---|---|
| Color | White | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | ****** |
| Density (g/cm³) | 2.2 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.020 | 0.030~0.200 0.25~0.50 | 0.75~5.00 |
ASTM D374 |
| Hardness (Shroe 00) | 65 | 45 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** |
| Breakdown Voltage (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @ 1MHz | 4.5 | ASTM D150 |
| Volume Resistivity | ＞1.0×10¹² Ohm-meter | ASTM D257 |
| Flame Rating | V-0 | UL 94 (E331100) |
| Thermal Conductivity | 1.5 W/m-K 1.5 W/m-K |
ASTM D5470 ISO22007 |
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
- Reinforcement Fabric: FG (Fiberglass)
- Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
- Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
- PET film or foam protection
- Paper card separation between layers
- Export carton packaging
- Customized packaging available
Lead Time: 5000 pieces - To be negotiated
Ziitek Electronic Material and Technology Ltd. provides product solutions for equipment that generates excessive heat affecting high performance. Our thermal products control and manage heat to maintain optimal operating temperatures.
- ISO9001:2015
- ISO14001:2004
- IATF16949:2016
- IECQ QC 080000:2017
- UL
- "Do it right the First time, total quality control" value message
- Core competencies in thermal conductive interface materials
- Competitive advantage products
- Confidentiality agreement and business secret contracts
- Free sample offers
- Quality assurance contracts
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.