Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets
Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets
The TIC®800T Series is an ultra-high thermal conductivity phase change material with a unique grain orientation structure. This structure achieves directional optimization of the heat flow path through micro ordered arrangement, significantly doubling the macroscopic thermal conductivity efficiency. When the temperature exceeds the phase transition point of 50℃, the material can soften and infiltrate the interface, filling micro irregular gaps, and ultimately forming a heat conduction channel with extremely low thermal resistance at the contact surface, improving the eficiency of the heat dissipation system.
Features
> Excellent thermal conductivity
> Good process compatibility
> Soft surface and self adhesive
> Low steady-state thermal resistance
Applications
> Power conversion equipment
> Payload processor
> Server CPU
> Game graphics card GPU chip heat dissipation
| Typical Properties of TIC®800T Series | |||
| Product Name | TIC®808T | TIC®810T | Testing standards |
| Color | Gray | Visual | |
|
Thickness(inch/mm) |
0.008" | 0.010" | ASTM D374 |
| (0.20mm) | (0.25mm) | ||
| Density(g/cm³) | 2.8 | ASTM D792 | |
| Recommended Operating Temperature (℃) |
-40～125 | - | |
| Phase Change Softening Temperature(℃) | 50~60 | - | |
| Thermal conductivity | 9.6 W/mK | ASTM D5470 | |
|
Thermal lmpedance (℃-in²/W)@10 psi |
0.018 | 0.019 | ASTM D5470 |
|
Thermal lmpedance (℃-in²/W)@50 psi |
0.013 | 0.014 | ASTM D5470 |
Product Specifications
Standard Thickness:0.008" (0.20 mm), 0.010" (0.25 mm)
Standard Size: 10" x 16" (254 mm x 406 mm)
TIC®series can be molded into different shapes to provide. If you need different thicknesses or would like to learn more about thermal conductive materials, please contact our company.
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.