Thermal Conductive Pad With Super Soft And Highly Compliant And 2W/mK Thermal Conductivity For Electronics
TIF®100-30-15U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.
- High thermal conductivity
- Super soft and highly compliant
- Self-adhesive without the need for additional surface adhesives
- Good insulation performance
- Mainboard/mother board
- Notebook
- Power supply
- Heat pipe thermal solutions
- Memory Modules
- Mass storage devices
- Set top boxes
- Audio and video components
- Power tools
- Network communication products
- Electric vehicle batteries
- Computer CPU/GPU Cooling
- New energy vehicle power systems
| Property | Value | Test Method |
|---|---|---|
| Color | Purple | Visual |
| Construction | Ceramic filled silicone elastomer | - |
| Density (g/cm³) | 3.0 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.020 | 0.030~0.200 0.25~0.50 | 0.75~5.00 |
ASTM D374 |
| Hardness (Shore 00) | 65 | 27 | ASTM 2240 |
| Recommended Operating Temperature (℃) | -40 to 200 | - |
| Breakdown Strength (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @1Mhz | 7.0 | ASTM D150 |
| Volume Resistivity (Ohm-cm) | ＞1.0×10¹² | ASTM D257 |
| Thermal Conductivity (W/m-K) | 3.0 | ASTM D5470 ISO22007 |
| Fire rating | V-0 | UL 94 (E331100) |
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
- Reinforcement Fabric: FG (Fiberglass)
- Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
- Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging Details:
- With PET film or foam for protection
- Paper card to separate each layer
- Export carton inside and outside
- Customized packaging to meet customer requirements
Lead Time:
Quantity: 5000 pieces
Estimated Time: To be negotiated
Ziitek, founded in 2006 and headquartered in Dongguan, Guangdong Province, is the world's leading manufacturer of thermal interface materials and thermal management solutions. After years of technical development, the company has built a complete product matrix including thermal interface materials, EMI shielding materials, heating products, foamed silica gel sealing rings, and heat conduction engineering plastics. With production bases in Kunshan, Taiwan Province and Vietnam, we provide one-stop thermal management solutions for customers worldwide.
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